| Course Category | Lecture and Tutorial |
| Level | Hauptstudium / Master |
| Semester | Summer Semester |
| Creditpoints | 5 CP |
Course Goal
The aim of the course is to impart knowledge about processes and plants which serve to house components and to connect components. Essential is the description of the processes which are part of the work areas packaging, surface mounting of components and chip on board.
Course Content
Packaging and interconnection technology is concerned with processes that serve to house components and to connect components. Processes for packaging, surface mounting of components and chip-on-board are presented.
- Fundamentals of SMD technology
- Methods of the COB technique
- Die-Bonds
- Wire bonding - Thermosonic, thermocompression and ultrasonic bonding
- Casting and moulding
- Advanced packaging
Winter Term 2024/25
| Registration and Schedule | digitally in StudIP |
| Exam registration period | 15.11. - 30.11.2024 |
| Date of examination | 28.03.2025 | 9:00 - 11:00 |
| Manual | Online in StudIP |
