Academia
Thesis Topics

Thesis Topics at the IMPT

The topics listed below are currently available (German). If you are interested, please contact the person mentioned in the announcement using exclusively your student university email address.

  • Investigation of oxygen-affine tool and workpiece coatings in XHV-adequate atmosphere

    Master thesis (starting now)

    Collaborative Research Center 1368 aims to gain a fundamental understanding of the processes and mechanisms in manufacturing processes under the complete exclusion of oxygen. In this context, tool and workpiece coatings, which are subject to high wear in normal atmospheres due to oxidation, are to be investigated for their suitability for use under XHV adequate atmospheres. The aim of this work is to analyze various coatings such as SiC, SiN, TiN, DLC for their suitability for use under XHV-adequate conditions with regard to their tribological and mechanical properties. The coatings will be investigated for their wear resistance, strength and diffusion tendency. In addition, the influence of the silane/SiO2 as well as possible influences by hydrogen inclusions on possible changes of the mechanical properties will be considered.

    Requirements are:

    • Knowledge in tribology
    • Comitted and creative way of working
    • Ideally attended courses: Microtechnology Lab

     

    Send your meaningful application documents by mail (only from your student email address) to Selina Raumel.

    Topic Announcment (German)
    PDF, 44 KB
  • Simulation-supported analysis of optical gratings by means of ellipsometry

    Bachelor/ Master thesis (starting now)

    At IMPT, atom chips are being developed as components of magneto-optical traps for compact matter wave interferometry. To make this technology usable in the field or on board a satellite, miniaturization will be further advanced. This will be done by fabricating a nanostructured diffraction grating on the atom chips. By cleverly exploiting diffraction effects, the number of lasers needed for cooling can be reduced.
    In this work, optical gratings will be lithographically patterned and microtechnologically transferred. Subsequently, ellipsometric measurements will be used for a simulation-supported analysis of the geometric properties. The generated data will be compared with images from scanning electron microscopy.

    Requirements are:

    • Independent, self-reliant work
    • Willingness to work in a clean room
    • Knowledge in the field of micro production technology is an advantage
    • Matlab knowledge is an advantage

    Send your meaningful application documents by mail (only from your student email address) to Sascha de Wall.

    Topic Announcment (German)
    PDF, 291 KB
  • Varying topics available in the scope of sensoric, electronic, simulation, big data, artificial intelligence

    You are interested in exciting and innovative projects in the context of novel sensor technology, electronics development, data acquisition and artificial intelligence?

    Are you looking for a thesis with long-term development opportunities, also in the direction of a doctorate degree?

    You are fascinated by these possible fields of activity: Sensor data fusion and pre-processing, edge computing, data acquisition, electronics development, data management, AI, sensor development, Internet-of-Things, Python, AWS, data warehouse, SQL databases, data mining, Matlab® & Simulink®, ANSYS®, smart sensors, hardware development, new sensor concepts, FPGA, software sensor technology, simulation, algorithmic optimization methods, particle swarm optimization, greedy algorithms, digital twin, deep learning, data science, big data, EAGLE, embedded systems.

    Then get in touch with Daniel Klaas and become part of a young and motivated team. We are interested in a long-term collaboration and offer you the opportunity to apply and develop your knowledge and skills in exciting research and industry projects.

    Requirements: Interested, independent students in the field of mechanical engineering, electrical engineering, mechatronics, information technology, (technical) computer science, physics and comparable.

  • Fabrication and characterization of field emitter chips for the use in miniaturized ion getter pumps

    Bachelor thesis (starting now)

    A high degree of miniaturization and integration of the vacuum system leads not only to the reduction of the housing, but also to the vacuum periphery in the corresponding order of magnitude. The goal is to develop a miniaturized pumping technique that can be used for compact and transportable quantum measurement technology. The pumping technique to be realized by IMPT is based on Si field emitters, which are fabricated in the form of tips by means of an abrasive cutting process. The aim of this student work is to fabricate an emitter chip consisting of a silicon chip with emitter array and a glass extraction electrode. The design of the extraction electrode shall be simulation based. Finally, the system is to be characterized.

    Requirements are:

    • independent, structured, goal-oriented way of working
    • interest in microsystems technology, eager for practical work

    Send your meaningful application documents by mail (only from your student email address) to Aleksandra Zawacka.

    Topic Announcement (German)
    PDF, 47 KB
  • Development of a high-precision pick-and-place process for joining microtools

    Master thesis (starting Sep. 1st until Feb. 28th, 2023)

    Micro milling cutters are being developed as part of a research project. These are constructed in two parts and consist of a tool shank and a tool head. For precise machining, the two parts must be brought together and joined with the utmost precision.Within this work, a joining process is therefore to be developed on a pick-and-place machine in cooperation with the Institute for Assembly Technology. For this purpose, the geometries of the tool heads and the tool shank are specified and the machine is to be taught by means of a self-developed program to carry out both adhesive distribution, placement and curing of the adhesive automatically. This process is to be evaluated and optimized in terms of placement accuracy, time required and possible sources of error. Further information is available on request.

    Requirements are: Knowledge of precision assembly and with programming languages

    Courses attended: precision assembly.

    Send your meaningful application documents by mail (only from your student email address) to Lukas Steinhoff.

    Thesis PDF (German)
    PDF, 96 KB
  • Process investigation of particle-filled sintering pastes for the optimization of a joining process

    Bachelor thesis or student project topic (starting now)

    Silver compound sintering is a joining process for high-performance electronic components. The advantages of the process are mainly the higher electrical and thermal conductivity as well as the higher mechanical strength compared to conventional assembly and joining techniques. By adding suitable low-melting point microscale alloying elements, eutectic alloys are to be formed, thus significantly lowering the process temperature. In previous investigations, a correlation between the hardness strength and the process temperature as a function of the filler content was observed. In this work, different filler contents as well as process parameters will be investigated to verify these dependencies.

    Requirements are:  Interest in microtechnology & Packaging and interconnection technology

    Send your meaningful application documents by mail (only from your student email address) to Steffen Hadeler.

    Topic Announcement (German)
    PDF, 142 KB
  • Development, fabrication, and characterization of miniaturized spring contact systems for ultracold quantum experiments based on powder-based laser beam fusion

    Master Thesis (starting now)

    The basis for the technical operability of the quantum experiments (ion trap technology) is ultracold matter, which is generated within the framework of a magneto-optical trap (MOT) by means of cryogenics, among other things. The central element of these quantum experiments is the quantum sensor, which is integrated in a receiver with periphery by means of a quantum processor unit (QPU). This QPU consists of a mounting frame and a base with integrated electro-mechanical components that ensure reproducible mounting and contacting of the quantum sensor. For a fully integrated, compact quantum system, these components are to be further developed, manufactured on the basis of powder-based laser beam fusion (LPBF) and characterized under cryogenic conditions.

    Requirements are:

    • Basics of technical mechanics and micro technology
    • structured and goal-oriented work approach
    • CV and transcript

    Send your meaningful application documents by mail (only from your student email address) to Leonard Diekmann.

    Topic Announcement (German)
    PDF, 49 KB
  • Development and characterization of an infrared sensor

    Bachelor/ Master Thesis / Student Project Topic (6 months/ starting now)

    Infrared thermography is used in particular in the medical context, where it is used for the near-surface analysis of physiological states and processes, such as the functional activity of the cerebral cortex or for the diagnosis of diseases. Infrared sensor systems currently available on the market usually use integrated cooling systems and additional emitters.The infrared sensor to be developed here will be implemented as a pure detector using a particularly sensitive material. For this purpose, a process chain for structuring the material using etching methods is being developed. After electrical contacting and proof of functionality by spectrometer measurements, the final sensor is to be designed as an array. This will later enable its use as an imaging measurement method.

    Requirements are: Willingness to work in a clean room, knowledge in the field of microtechnology, optics and measurement technology.

    Send your meaningful application documents by mail (only from your student email address) to Rico Ottermann.

    Topic Announcement
    PDF, 40 KB
  • Development and characterization of a hermetic bond for the fabrication of miniaturized atomic gas cells

    Master Thesis (6 months/ starting now)

    An atomic gas cell is the core component in many different quantum sensors. These include atomic clocks or optically pumped magnetometers, among others. For these cells, the hermetic connection of two components is mandatory. This prevents gas exchange with the environment, as well as contamination inside the cell. As a result, the composition and pressure of the atmosphere inside the cell can be precisely controlled. The atomic gas cells will be fabricated using microtechnology manufacturing techniques by hermetically bonding a patterned silicon chip to a glass chip. The goal of this student project is to develop a reproducible hermetic bond between glass and silicon for the fabrication of such an atomic gas cell, and to characterize the hermeticity of this bond.

    Prerequisites are:

    • independent, structured, goal-oriented way of working
    • interested in microsystems technology


    Please send an informative application via mail (stud.uni-hannover.de) to Jannik Koch.

    Topic Announcement
    PDF, 45 KB
  • Herstellung und Kontaktierung eines hochtemperatur Messaufbaus in der Strangpressmatrize

    Bachelor/ Project/ Master Thesis (6 months/starting now)

    Hohe Betriebstemperaturen sind allgegenwärtig: Sie sind in Antriebseinheiten, in industriellen Produktionsprozessen, wie der Warmverformung und der maschinellen Bearbeitung zu finden. Um optimale Produktionsergebnisse zu erzielen, werden daher bei den meisten Produktionsprozessen Messungen der Werkzeugtemperatur durchgeführt. Auch beim Strangpressen ist eine präzise Temperaturerfassung notwendig um sowohl die Maßhaltigkeit der Endprodukte als auch deren mechanische Eigenschaften und Spezifikationen zu kontrollieren und sicher zu stellen. Ziel dieser Arbeit ist es, eine Prozesskette zur Herstellung eines Integrationskonzeptes für eine Temperaturmessung nahe der Umformzone beim Strangpressen zu entwickeln, die Hochtemperaturkontaktierung zu realisieren und das Einsatzverhalten, sowie die Anwendbarkeit zu evaluieren.


    Required Skills:

    Kenntnisse in Konstruktion, engagierte und kreative Arbeitsweise. Idealerweise besuchte Lehrveranstaltungen: Mikrotechniklabor


    Please send your application per e-mail (stud.uni-hannover.de) to Selina Raumel.

    Topic Announcement
    PDF, 43 KB
  • Evaluation und Optimierung eines PECVD-Prozesses zur Fertigung von Isolationsschichten aus Si3N4 und SiO2

    Bachelor/ Project/ Master Thesis (6 months/starting now)

    Das Forschungsprojekt KACTUS II verfolgt das Ziel, die Atomchiptechnologie in eine neue Generation zu überführen und diese um weitere Funktionen zu ergänzen. Hierbei ist die Auswahl geeigneter Materialien und Fertigungsprozesse entscheidend, sodass ein schnelleres Schaltverhalten sowie bessere Vakuumeigenschaften erzielt werden können. Die zunehmende Funktionalisierung und Erweiterung der Integrationsdichte ermöglicht die weitere Miniaturisierung der Atomchips sowie des Gesamtaufbaus, um den Technologieeinsatz in kommerziellen Anwendungen zu ermöglichen. Für die Erweiterung der Integrationsdichte sowie zur Erhöhung der Belastbarkeit der stromführenden Strukturen der Atomchips sind entsprechende Isolationsschichten unerlässlich. Daher ist im Rahmen dieser Arbeit ein PECVD Prozess zu untersuchen und anzupassen, um die Eigenschaften der Isolationsschichten gezielt einstellen zu können. Abschließend ist der Prozess in die Fertigungskette der Atomchips zu integrieren.


    Voraussetzungen:
    Selbständige, strukturierte, eigenverantwortliche Arbeitsweise; Interesse an Mikrosystemtechnik; Spaß an praktischer Tätigkeit, Bereitschaft zur Reinraumtätigkeit


    Senden Sie Ihre aussagekräftigen Bewerbungsunterlagen per Mail (stud.uni-hannover.de) an Christoph Künzler.

    Topic Announcement
    PDF, 46 KB
  • Zusammenfassung des aktuellen Forschungsstandes im Bereich der Atomchiptechnologie (Literaturrecherche)

    Bachelor Thesis, Project Topic (6 months/starting now)

    Das Forschungsprojekt KACTUS II verfolgt das Ziel, die Atomchiptechnologie in eine neue Generation zu überführen und diese um weitere Funktionen zu ergänzen. Hierbei ist die Auswahl geeigneter Materialien und Fertigungsprozesse entscheidend, sodass ein schnelleres Schaltverhalten sowie bessere Vakuumeigenschaften erzielt werden können. Die zunehmende Funktionalisierung und Erweiterung der Integrationsdichte ermöglicht die weitere Miniaturisierung der Atomchips sowie des Gesamtaufbaus, um den Technologieeinsatz in kommerziellen Anwendungen zu ermöglichen.
    Mit dieser Arbeit soll der aktuelle Forschungsstand im Bereich der Atomchiptechnologie abgebildet und neue Entwicklungen aufgezeigt werden. Dabei sind sowohl die Miniaturisierungen der peripheren Aufbauten als auch die Fertigungstechnologien für Atomchips zu betrachten. Dies erfolgt auf Grundlage einer entsprechenden Literaturrecherche.


    Voraussetzungen:
    Selbständige, strukturierte, eigenverantwortliche Arbeitsweise; Sehr gute Englischkenntnisse; Spaß daran, sich wissenschaftlichen Fragestellungen theoretisch zu nähern


    Senden Sie Ihre aussagekräftigen Bewerbungsunterlagen per Mail (stud.uni-hannover.de) an Christoph Künzler.

    Topic Announcement
    PDF, 45 KB

Research Topics and Unsolicited Applications

We mainly offer topics from the two areas of thin film technology and mechanical micromachining and tribology. These areas are described in more detail below. If you have any questions regarding the topics, please direct them to the contacts listed. Do you have an idea or are you interested in a specific topic and would like to write a paper on it? We are always open to working on topics with students and are happy to receive unsolicited applications!

Thin Film Technology

The field of thin-film technology at IMPT covers the design and manufacture of microsystems/MEMS (sensors, actuators). The underlying effect of most of these systems is electromagnetism.

  • Design

    The initial system design is done by analytical and network-based methods. The detailed design is then carried out using FEM simulations. For this purpose, the multiphysics simulation tool ANSYS® is available, with which simulations e.g. in the fields of structural mechanics and electromagnetics as well as thermal and fluid dynamic simulations can be performed.

  • Actuators

    The actuators manufactured at the IMPT use magnetic fields to generate movement. Depending on their operating principle, the actuators can be classified as synchronous, (variable) reluctance, and hybrid actuators. Both linear and rotating micromotors are manufactured, and the use of these magnetic microactuators is being investigated, e.g. in microoptics, the manipulation of magnetic nanoparticles and implantology.

  • Sensors

    In addition to sensors based on electromagnetic principles, such as eddy current sensors, strain sensors, and GMR sensors (ultra-thin, for high-temperature applications), research at the IMPT focuses on modular sensors for gentelligent applications, including temperature sensors.

  • Manufacture

    For the production of microactuators and sensors a combination of photolithography and electrodeposition is routinely used. Using photolithography, a temporary form of photoresist is created on Si or Al2O3 substrates and filled with functional materials by electrodeposition. As functional materials Cu is used for coils and leads. NiFe45/55, NiFe81/19, CoFe and Ni are used for flow guides. Furthermore, the epoxy resin SU-8™ and polyimide are used as embedding material and material for membranes. As insulation layers of Si3N4 and SiO2 are used, which are produced by PECVD (Plasma Enhanced Chemical Vapor Deposition). For patterning, ion beam etching and lift-off are also used. The production of mechanical components (membranes, bending beams, spring structures...) is done by a combination of photolithography and etching processes. For this purpose dry etching processes (e.g. DRIE, plasma) as well as wet chemical etching processes (e.g. KOH, HF) are available.

Topics in this field may have the following main focuses:

  • The fabrication and characterization of microsystems
  • The development and optimization of manufacturing processes
  • Layer characterizations
  • Materials testing
© IMPT / Fischer
Alexander Kassner, M. Sc.
Management
Address
An der Universität 2
30823 Garbsen
Building
Room
107
© IMPT / Fischer
Alexander Kassner, M. Sc.
Management
Address
An der Universität 2
30823 Garbsen
Building
Room
107

Mechanical Micromachining and Tribology

  • Mechanical Micromachining

    In the field of mechanical micro-machining, different processes are used. On the one hand, cutting-off and profile grinding processes are carried out for high-precision separation and profiling of micro-components made of ceramics, glass and silicon. On the other hand, nano-grinding and lapping processes are carried out for high-precision surface treatment of brittle-hard materials and the creation of micrographs. Furthermore, processes for the production of surfaces of high quality as well as the planarization of wafer surfaces of material combinations by polishing and chemical-mechanical polishing (CMP) are performed.

  • Microtribology

    In the field of microtribology, for example, wear investigations are carried out on a rotary wear measuring stand using the pin-on-disk method for flat microcontact. Furthermore, investigations on microhardness and Young's modulus as well as the representation of (adhesive) friction of thin layers by means of nanoindentation and scratch investigations are carried out. The breaking strength of coatings is determined by means of acoustic emission. Additionally, analyses of friction forces in microcontact are carried out.

Topics in this field may have the following main focus:

  • Generation of highly accurate edges and microprofiles
  • Optimization of a wafer holder tool for chemical mechanical polishing (CMP)
  • Joining of micro components by means of soldering, eutectic and anodic bonding
  • Investigation and characterization of tribological coatings