Thesis Topics

Thesis Topics at the IMPT

The topics listed below are currently available (German). If you are interested, please contact the person mentioned in the announcement using exclusively your student university email address.

  • Design, fabrication and characterization of a DC-DC converter with injection-molded plastic inductance

    Master thesis (starting now)

    The EU project GaN4AP is developing novel transformers in the high-frequency range for the charging technology of hybrid and electric cars. The IMPT participates in this project with the production of planar injection molded electromagnetic components in the form of transformers, chokes and inductors. In this work, a commercially available DC-DC converter will be adapted with an injection molded inductor. For this purpose, the inductor are simulated using Ansys Maxwell 3D on injection molded plastic substrates consisting of PEEK. The core material is completely enclosed  of PEEK by the injection molding process. The laser activations of the PEEK enables the conductive paths around the core to be deposited with electroless plating. The manufactured inductance is then incorporated into the DC/DC converter, characterized and compared with the original converter.

    Requirements are:

    • Independent, well structured, self dependent way of working
    • Electrical engineering knowledge
    • Knowledge or willingness to learn Ansys Maxwell 3D and Draftsight


    Send your meaningful application documents by mail (only from your student email address) to Tim Bierwirth.

    Topic Announcement
    PDF, 36 KB
  • Development and characterisation of a transient liquid phase bond process for the production of hermetic packages

    Bachelor/Master thesis (starting now)

    Hermetic packages form the basis for miniaturised quantum systems. These include, among others, atomic clocks, atomic gyroscopes, atomic interferometers or optically pumped magnetometers. For these packages, the hermetic sealing of two or more components is essential to prevent gas exchange with the environment. This allows the composition of the atmosphere, as well as the pressure conditions inside the cell, to be precisely controlled. For the miniaturisation of the quantum systems, the hermetic cells are to be produced with microtechnological manufacturing processes by hermetically bonding the components with the help of additional thin films. One promising method is the Transient Liquid Phase process (TLP process). The aim of the work is to develop and evaluate a reliable, reproducible, hermetic bond using TLP.

    Requirements are:

    • Independent working methods
    • Interest in microsystem technology


    Send your meaningful application documents by mail (only from your student email address) to Jannik Koch.

    Topic Announcement
    PDF, 40 KB
  • Development of a multilayer coating system with integrated fluid channels

    Bachelor/Student thesis (01.04.23-30.09.23)

    Within the scope of a research project, peripheral grinding wheels with a multilayer system for profiling workpieces were developed. In addition, channel structures are to be integrated into this layer system, via which cooling lubricant can be directed through the tool holder to the contact zone between tool and workpiece. For this purpose, a design for the fluid channels and a process plan for the production of a layer stack with integrated channel structures are to be developed in the work by means of microsystem-technical process techniques. By manufacturing such a system in the institute's own clean room, both design and process plan will be tested for functionality.
    Further information is available on request.

    Requirements are:

    • Knowledge in microsystemtechnology desirable


    Send your meaningful application documents by mail (only from your student email address) to Lukas Steinhoff.

    Topic Announcment (German)
    PDF, 97 KB
  • Investigation of oxygen-affine tool and workpiece coatings in XHV-adequate atmosphere

    Master thesis (starting now)

    Collaborative Research Center 1368 aims to gain a fundamental understanding of the processes and mechanisms in manufacturing processes under the complete exclusion of oxygen. In this context, tool and workpiece coatings, which are subject to high wear in normal atmospheres due to oxidation, are to be investigated for their suitability for use under XHV adequate atmospheres. The aim of this work is to analyze various coatings such as SiC, SiN, TiN, DLC for their suitability for use under XHV-adequate conditions with regard to their tribological and mechanical properties. The coatings will be investigated for their wear resistance, strength and diffusion tendency. In addition, the influence of the silane/SiO2 as well as possible influences by hydrogen inclusions on possible changes of the mechanical properties will be considered.

    Requirements are:

    • Knowledge in tribology
    • Comitted and creative way of working
    • Ideally attended courses: Microtechnology Lab


    Send your meaningful application documents by mail (only from your student email address) to Selina Raumel.

    Topic Announcment (German)
    PDF, 44 KB
  • Simulation-supported analysis of optical gratings by means of ellipsometry

    Bachelor/ Master thesis (starting now)

    At IMPT, atom chips are being developed as components of magneto-optical traps for compact matter wave interferometry. To make this technology usable in the field or on board a satellite, miniaturization will be further advanced. This will be done by fabricating a nanostructured diffraction grating on the atom chips. By cleverly exploiting diffraction effects, the number of lasers needed for cooling can be reduced.
    In this work, optical gratings will be lithographically patterned and microtechnologically transferred. Subsequently, ellipsometric measurements will be used for a simulation-supported analysis of the geometric properties. The generated data will be compared with images from scanning electron microscopy.

    Requirements are:

    • Independent, self-reliant work
    • Willingness to work in a clean room
    • Knowledge in the field of micro production technology is an advantage
    • Matlab knowledge is an advantage

    Send your meaningful application documents by mail (only from your student email address) to Sascha de Wall.

    Topic Announcment (German)
    PDF, 291 KB
  • Fabrication and characterization of an optical micro-platform

    Project/Master thesis (starting now)

    In the manufacture of photonic components, the trend is increasingly toward increased complexity, miniaturization and integration density. One possible approach for manufacturing the next generation of photonic components is to increase flexibility while reducing costs. To this end, an optical table is to be miniaturized in such a way that optical components such as filters or diodes can be used flexibly and interchangeably on it. The optical path is monolithic by using optical fibers. Within the scope of this work, an existing platform and optical waveguide design will first be manufactured and characterized. For this purpose, the manufacturing process shall be evaluated and the functionality of the system shall be confirmed. The main focus shall be on the achievable attenuation.

    Finally, based on the obtained investigation results, a more advanced demonstrator system shall be designed, fabricated and characterized.

    Requirements are:

    • Knowledge in microtechnologie, optics, injection molding and laser technology desirable
    • Commited and creative way of working

    Send your meaningful application documents by mail (only from your student email address) to Robin Basten.

    Topic Announcement (German)
    PDF, 47 KB
  • Development, manufacture and characterization of punches for ultrasonic hot embossing of optical components

    Project/master thesis (starting now)

    Hot stamping processes with plastics or glasses are used as standard for the production of optical components such as lenses or gratings. The demands on the quality and quantity of these microcomponents are constantly increasing. A promising approach is the use of ultrasound in the hot stamping process. Within the scope of this work, embossing dies are to be designed and manufactured. For this purpose, a comprehensive material and process analysis will first be carried out in order to find a suitable stamp material. The main focus will be on the achievable surface qualities as well as the attainable impression accuracy. On the basis of the results obtained, a demonstrator system will be designed, manufactured and characterized, which can be used in cooperation with IDS for structuring glass substrates.

    Requirements are:

    • Knowledge in microtechnology, materials science, 3D-printing, injection molding and laser technology desirable
    • Commited and creative way of working

    Send your meaningful application documents by mail (only from your student email address) to Robin Basten.

    Topic Announcement (German)
    PDF, 45 KB
  • Varying topics available in the scope of sensoric, electronic, simulation, big data, artificial intelligence

    You are interested in exciting and innovative projects in the context of novel sensor technology, electronics development, data acquisition and artificial intelligence?

    Are you looking for a thesis with long-term development opportunities, also in the direction of a doctorate degree?

    You are fascinated by these possible fields of activity: Sensor data fusion and pre-processing, edge computing, data acquisition, electronics development, data management, AI, sensor development, Internet-of-Things, Python, AWS, data warehouse, SQL databases, data mining, Matlab® & Simulink®, ANSYS®, smart sensors, hardware development, new sensor concepts, FPGA, software sensor technology, simulation, algorithmic optimization methods, particle swarm optimization, greedy algorithms, digital twin, deep learning, data science, big data, EAGLE, embedded systems.

    Then get in touch with Daniel Klaas and become part of a young and motivated team. We are interested in a long-term collaboration and offer you the opportunity to apply and develop your knowledge and skills in exciting research and industry projects.

    Requirements: Interested, independent students in the field of mechanical engineering, electrical engineering, mechatronics, information technology, (technical) computer science, physics and comparable.

  • Development, fabrication, and characterization of miniaturized spring contact systems for ultracold quantum experiments based on powder-based laser beam fusion

    Master Thesis (starting now)

    The basis for the technical operability of the quantum experiments (ion trap technology) is ultracold matter, which is generated within the framework of a magneto-optical trap (MOT) by means of cryogenics, among other things. The central element of these quantum experiments is the quantum sensor, which is integrated in a receiver with periphery by means of a quantum processor unit (QPU). This QPU consists of a mounting frame and a base with integrated electro-mechanical components that ensure reproducible mounting and contacting of the quantum sensor. For a fully integrated, compact quantum system, these components are to be further developed, manufactured on the basis of powder-based laser beam fusion (LPBF) and characterized under cryogenic conditions.

    Requirements are:

    • Basics of technical mechanics and micro technology
    • structured and goal-oriented work approach
    • CV and transcript

    Send your meaningful application documents by mail (only from your student email address) to Leonard Diekmann.

    Topic Announcement (German)
    PDF, 49 KB

Research Topics and Unsolicited Applications

We mainly offer topics from the two areas of thin film technology and mechanical micromachining and tribology. These areas are described in more detail below. If you have any questions regarding the topics, please direct them to the contacts listed. Do you have an idea or are you interested in a specific topic and would like to write a paper on it? We are always open to working on topics with students and are happy to receive unsolicited applications!

Thin Film Technology

The field of thin-film technology at IMPT covers the design and manufacture of microsystems/MEMS (sensors, actuators). The underlying effect of most of these systems is electromagnetism.

  • Design

    The initial system design is done by analytical and network-based methods. The detailed design is then carried out using FEM simulations. For this purpose, the multiphysics simulation tool ANSYS® is available, with which simulations e.g. in the fields of structural mechanics and electromagnetics as well as thermal and fluid dynamic simulations can be performed.

  • Actuators

    The actuators manufactured at the IMPT use magnetic fields to generate movement. Depending on their operating principle, the actuators can be classified as synchronous, (variable) reluctance, and hybrid actuators. Both linear and rotating micromotors are manufactured, and the use of these magnetic microactuators is being investigated, e.g. in microoptics, the manipulation of magnetic nanoparticles and implantology.

  • Sensors

    In addition to sensors based on electromagnetic principles, such as eddy current sensors, strain sensors, and GMR sensors (ultra-thin, for high-temperature applications), research at the IMPT focuses on modular sensors for gentelligent applications, including temperature sensors.

  • Manufacture

    For the production of microactuators and sensors a combination of photolithography and electrodeposition is routinely used. Using photolithography, a temporary form of photoresist is created on Si or Al2O3 substrates and filled with functional materials by electrodeposition. As functional materials Cu is used for coils and leads. NiFe45/55, NiFe81/19, CoFe and Ni are used for flow guides. Furthermore, the epoxy resin SU-8™ and polyimide are used as embedding material and material for membranes. As insulation layers of Si3N4 and SiO2 are used, which are produced by PECVD (Plasma Enhanced Chemical Vapor Deposition). For patterning, ion beam etching and lift-off are also used. The production of mechanical components (membranes, bending beams, spring structures...) is done by a combination of photolithography and etching processes. For this purpose dry etching processes (e.g. DRIE, plasma) as well as wet chemical etching processes (e.g. KOH, HF) are available.

Topics in this field may have the following main focuses:

  • The fabrication and characterization of microsystems
  • The development and optimization of manufacturing processes
  • Layer characterizations
  • Materials testing
© IMPT / Fischer
Alexander Kassner, M. Sc.
An der Universität 2
30823 Garbsen
© IMPT / Fischer
Alexander Kassner, M. Sc.
An der Universität 2
30823 Garbsen

Mechanical Micromachining and Tribology

  • Mechanical Micromachining

    In the field of mechanical micro-machining, different processes are used. On the one hand, cutting-off and profile grinding processes are carried out for high-precision separation and profiling of micro-components made of ceramics, glass and silicon. On the other hand, nano-grinding and lapping processes are carried out for high-precision surface treatment of brittle-hard materials and the creation of micrographs. Furthermore, processes for the production of surfaces of high quality as well as the planarization of wafer surfaces of material combinations by polishing and chemical-mechanical polishing (CMP) are performed.

  • Microtribology

    In the field of microtribology, for example, wear investigations are carried out on a rotary wear measuring stand using the pin-on-disk method for flat microcontact. Furthermore, investigations on microhardness and Young's modulus as well as the representation of (adhesive) friction of thin layers by means of nanoindentation and scratch investigations are carried out. The breaking strength of coatings is determined by means of acoustic emission. Additionally, analyses of friction forces in microcontact are carried out.

Topics in this field may have the following main focus:

  • Generation of highly accurate edges and microprofiles
  • Optimization of a wafer holder tool for chemical mechanical polishing (CMP)
  • Joining of micro components by means of soldering, eutectic and anodic bonding
  • Investigation and characterization of tribological coatings