Thesis Topics at the IMPT

The topics listed below are currently available (German). If you are interested, please contact the person mentioned in the announcement using exclusively your student university email address.

Bachelor Thesis Topics

Student Project Topics

Master Thesis Topics

Research Topics and Unsolicited Applications

We mainly offer topics from the two areas of thin film technology and mechanical micromachining and tribology. These areas are described in more detail below. If you have any questions regarding the topics, please direct them to the contacts listed. Do you have an idea or are you interested in a specific topic and would like to write a paper on it? We are always open to working on topics with students and are happy to receive unsolicited applications!

Thin Film Technology

The field of thin-film technology at IMPT covers the design and manufacture of microsystems/MEMS (sensors, actuators). The underlying effect of most of these systems is electromagnetism.

  • Design

    The initial system design is done by analytical and network-based methods. The detailed design is then carried out using FEM simulations. For this purpose, the multiphysics simulation tool ANSYS® is available, with which simulations e.g. in the fields of structural mechanics and electromagnetics as well as thermal and fluid dynamic simulations can be performed.

  • Actuators

    The actuators manufactured at the IMPT use magnetic fields to generate movement. Depending on their operating principle, the actuators can be classified as synchronous, (variable) reluctance, and hybrid actuators. Both linear and rotating micromotors are manufactured, and the use of these magnetic microactuators is being investigated, e.g. in microoptics, the manipulation of magnetic nanoparticles and implantology.

  • Sensors

    In addition to sensors based on electromagnetic principles, such as eddy current sensors, strain sensors, and GMR sensors (ultra-thin, for high-temperature applications), research at the IMPT focuses on modular sensors for gentelligent applications, including temperature sensors.

  • Manufacture

    For the production of microactuators and sensors a combination of photolithography and electrodeposition is routinely used. Using photolithography, a temporary form of photoresist is created on Si or Al2O3 substrates and filled with functional materials by electrodeposition. As functional materials Cu is used for coils and leads. NiFe45/55, NiFe81/19, CoFe and Ni are used for flow guides. Furthermore, the epoxy resin SU-8™ and polyimide are used as embedding material and material for membranes. As insulation layers of Si3N4 and SiO2 are used, which are produced by PECVD (Plasma Enhanced Chemical Vapor Deposition). For patterning, ion beam etching and lift-off are also used. The production of mechanical components (membranes, bending beams, spring structures...) is done by a combination of photolithography and etching processes. For this purpose dry etching processes (e.g. DRIE, plasma) as well as wet chemical etching processes (e.g. KOH, HF) are available.

Topics in this field may have the following main focuses:

  • The fabrication and characterization of microsystems
  • The development and optimization of manufacturing processes
  • Layer characterizations
  • Materials testing
© IMPT / Fischer
Dr.-Ing. Alexander Kassner
Management
Address
An der Universität 2
30823 Garbsen
Building
Room
107
© IMPT / Fischer
Dr.-Ing. Alexander Kassner
Management
Address
An der Universität 2
30823 Garbsen
Building
Room
107

Mechanical Micromachining and Tribology

  • Mechanical Micromachining

    In the field of mechanical micro-machining, different processes are used. On the one hand, cutting-off and profile grinding processes are carried out for high-precision separation and profiling of micro-components made of ceramics, glass and silicon. On the other hand, nano-grinding and lapping processes are carried out for high-precision surface treatment of brittle-hard materials and the creation of micrographs. Furthermore, processes for the production of surfaces of high quality as well as the planarization of wafer surfaces of material combinations by polishing and chemical-mechanical polishing (CMP) are performed.

  • Microtribology

    In the field of microtribology, for example, wear investigations are carried out on a rotary wear measuring stand using the pin-on-disk method for flat microcontact. Furthermore, investigations on microhardness and Young's modulus as well as the representation of (adhesive) friction of thin layers by means of nanoindentation and scratch investigations are carried out. The breaking strength of coatings is determined by means of acoustic emission. Additionally, analyses of friction forces in microcontact are carried out.

Topics in this field may have the following main focus:

  • Generation of highly accurate edges and microprofiles
  • Optimization of a wafer holder tool for chemical mechanical polishing (CMP)
  • Joining of micro components by means of soldering, eutectic and anodic bonding
  • Investigation and characterization of tribological coatings