The topics listed below are currently available (German). If you are interested, please contact the person mentioned in the announcement using exclusively your student university email address.
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Simulation-Supported Analysis of Optical Gratings Using Ellipsometry
Bachelor or Student thesis (starting now)
At IMPT, atom chips are being developed as components of magneto-optical traps for compact matter wave interferometry. To make this technology usable in the field or on board a satellite, miniaturization will be further advanced. This will be accomplished by fabricating a nanostructured diffraction grating on the atomic chips. By cleverly exploiting diffraction effects, the number of lasers needed for cooling can be reduced. In the context of this work, optical gratings are to be lithographically structured and microtechnologically transferred. Subsequently, ellipsometric measurements will be used for a simulation-supported analysis of the geometric properties. The generated data will be finalised and compared with images from scanning electron microscopy.
- Matlab knowledge advantageous -Requirements are:
- Independent, self-reliant work
- Willingness to work in a clean room
- Knowledge in the field of microproduction technology is an advantage
Send your meaningful application documents by mail (only from your student email address) to Sascha de Wall.
Topic AnnouncementPDF, 37 KB -
Development of a drift detection and characteristic compensation for sensor
Bachelor or Student thesis (starting now)
Novel sensor and sensor manufacturing technologies are being researched at the Institute of Microproduction Technology. Strain gauges can develop a drift (long-term drift), whereby the output signal (strain) changes over time during a constant input (force, torque). This measurement deviation is undesirable. In this thesis a method for drift detection and characteristic compensation shall be developed. A FE-model or an analytical model of a reference component equipped with sensors is used as a basis. The drift detection and characteristic compensation is to be implemented and empirically validated on an existing test bench.
Requirements are:
- Experience with Mathlab/Simulink and/or Python
- Good knowledge in technical mechanics
- Experience in microcontroller programming (desirable)
- Experience with Beckhoff/TwinCAT (desirable)
Send your meaningful application documents by mail (only from your student email address) to Nico Dieckmann.
Topic AnnouncementPDF, 211 KB -
Quanten computing: Development of a Faraday module for a quantum processor unit
Bachelor or Student thesis (starting now)
Quantum computers use 2 state quantum systems and quantum entanglement instead of conventional bit states The experimental basis of the underlying quantum systems are ultracold charged atoms, which are generated, controlled and functionalized (in a cryogenic ultra high vacuum with a magneto optical trap The focus of the experiment is the complete shielding of the technology platform with a Faraday Module ( within the Quantum Processing Unit ( This Faraday module is part of the QPU's attachment frame and requires integration based on transient liquid phase ( bonding In this way, a compact quantum system can be enabled by progressive integration density.
Requirements are:
- Independent, self-reliant work
- Degree programme: mechanical engineering, nanotechnology, physics or similar
Send your meaningful application documents by mail (only from your student email address) to Leonard Diekmann.
Topic AnnouncementPDF, 46 KB -
Production and characterisation of electrical insulation layers for use in atom chips
Bachelor thesis (starting now)
At the IMPT, atom chips are developed as components of magneto-optical traps for compact matter wave interferometry. To generate strong magnetic fields, conductive tracks are embedded in the substrate using microtechnology. Due to the use of silicon as substrate material, an electrical insulation between the conductors and the substrate is necessary.
In this work, cavities are to be created in Si by means of DRIE and then electrically insulated by means of PECVD (SiO2, Si3N4) and ALD (Al2O3). Subsequently, investigations will be carried out to characterise the electrical insulation capability. In the institute's own thermal shock chamber, which is used for rapid, cyclical temperature loading of samples, the produced samples are subjected to final climatic tests in order to analyse the temperature resistance of the coatings with regard to their adhesive strength.
Requirements are:
- Independent, self-reliant work
- Willingness to work in a clean room
- Knowledge in the field of micro production technology is an advantage
Send your meaningful application documents by mail (only from your student email address) to Sascha de Wall.
Topic AnnouncementPDF, 61 KB -
Varying topics: Big Data, Artificial Intelligence, Data Analysis, Electronics, Simulation and Sensors
You are interested in exciting and innovative projects in the context of novel sensor technology, electronics development, data acquisition and artificial intelligence?
Are you looking for a thesis with long-term development opportunities, also in the direction of a doctorate degree?
You are fascinated by these possible fields of activity: Sensor data fusion and pre-processing, edge computing, data acquisition, electronics development, data management, AI, sensor development, Internet-of-Things, Python, AWS, data warehouse, SQL databases, data mining, Matlab® & Simulink®, ANSYS®, smart sensors, hardware development, new sensor concepts, FPGA, software sensor technology, simulation, algorithmic optimization methods, particle swarm optimization, greedy algorithms, digital twin, deep learning, data science, big data, EAGLE, embedded systems.
Then get in touch with Daniel Klaas and become part of a young and motivated team. We are interested in a long-term collaboration and offer you the opportunity to apply and develop your knowledge and skills in exciting research and industry projects.
Requirements: Interested, independent students in the field of mechanical engineering, electrical engineering, mechatronics, information technology, (technical) computer science, physics and comparable.
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Evaluation and optimization of a PECVD process for the production of insulating layers of Si3N4
Bachelor- or Studentthesis (starting from now)
The KACTUS II research project is pursuing the goal of transferring atomic chip technology to a new generation and supplementing it with additional functions. The selection of suitable materials and manufacturing processes is crucial here, so that faster switching behavior and better vacuum properties can be achieved. The increasing functionalization and expansion of the integration density enables a further miniaturization of the atom chips as well as the overall structure to enable the use of the technology in commercial applications. Insulation layers are essential for the expansion of the integration density as well as to increase the power handling capability of the current carrying structures. Within the scope of this work, the PECVD process for the deposition of Si3N4 is to be investigated. For this purpose, the layer properties are to be evaluated as a function of the process parameters.
Requirements are:
- Independent, well-structured, self-reliant way of working
- Interst in micro system technology
- Enjoyment of practical work, willingness to work in a clean room
Send your meaningful application documents by mail (only from your student email address) to Christoph Künzler.
Topic Announcement (German)PDF, 192 KB -
Quantum computing: Variable topics on the thermal management of a quantum processor unit
Bachelor- or Studentthesis (starting from July)
Quantum computers use 2-state quantum systems and quantum entanglement instead of traditional bit states. The experimental basis of the underlying quantum systems are ultra-cold, charged atoms, which are generated, controlled and functionalized (entanglement) in a cryogenic ultra-high vacuum with a magneto-optical trap. The focus of the experiment is the reversible contacting of the technology platform with the help of the quantum processor unit (QPU). This QPU consists of a mounting frame and a base with integrated, micro-technological components. In the context of progressive integration towards a compact quantum system and thus utilization of the technologies in an industrial application, these components are to be further developed and evaluated.
Requirements are:
Interested, independent and capable students of mechanical engineering, electrical engineering, mechatronics, information technology, (technical) computer science, physics and similar courses
Send your meaningful application documents by mail (only from your student email address) to Leonard Diekmann.
Topic AnnouncementPDF, 38 KB -
Investigation of oxygen-affine tool and workpiece coatings in XHV-adequate atmosphere
Master thesis (starting now)
Collaborative Research Center 1368 aims to gain a fundamental understanding of the processes and mechanisms in manufacturing processes under the complete exclusion of oxygen. In this context, tool and workpiece coatings, which are subject to high wear in normal atmospheres due to oxidation, are to be investigated for their suitability for use under XHV adequate atmospheres. The aim of this work is to analyze various coatings such as SiC, SiN, TiN, DLC for their suitability for use under XHV-adequate conditions with regard to their tribological and mechanical properties. The coatings will be investigated for their wear resistance, strength and diffusion tendency. In addition, the influence of the silane/SiO2 as well as possible influences by hydrogen inclusions on possible changes of the mechanical properties will be considered.
Requirements are:
- Knowledge in tribology
- Comitted and creative way of working
- Ideally attended courses: Microtechnology Lab
Send your meaningful application documents by mail (only from your student email address) to Selina Raumel.
Topic Announcment (German)PDF, 44 KB -
Fabrication and characterization of an optical micro-platform
Project/Master thesis (starting now)
In the manufacture of photonic components, the trend is increasingly toward increased complexity, miniaturization and integration density. One possible approach for manufacturing the next generation of photonic components is to increase flexibility while reducing costs. To this end, an optical table is to be miniaturized in such a way that optical components such as filters or diodes can be used flexibly and interchangeably on it. The optical path is monolithic by using optical fibers. Within the scope of this work, an existing platform and optical waveguide design will first be manufactured and characterized. For this purpose, the manufacturing process shall be evaluated and the functionality of the system shall be confirmed. The main focus shall be on the achievable attenuation.
Finally, based on the obtained investigation results, a more advanced demonstrator system shall be designed, fabricated and characterized.
Requirements are:
- Knowledge in microtechnologie, optics, injection molding and laser technology desirable
- Commited and creative way of working
Send your meaningful application documents by mail (only from your student email address) to Robin Basten.
Topic Announcement (German)PDF, 47 KB -
Development, manufacture and characterization of punches for ultrasonic hot embossing of optical components
Project/master thesis (starting now)
Hot stamping processes with plastics or glasses are used as standard for the production of optical components such as lenses or gratings. The demands on the quality and quantity of these microcomponents are constantly increasing. A promising approach is the use of ultrasound in the hot stamping process. Within the scope of this work, embossing dies are to be designed and manufactured. For this purpose, a comprehensive material and process analysis will first be carried out in order to find a suitable stamp material. The main focus will be on the achievable surface qualities as well as the attainable impression accuracy. On the basis of the results obtained, a demonstrator system will be designed, manufactured and characterized, which can be used in cooperation with IDS for structuring glass substrates.
Requirements are:
- Knowledge in microtechnology, materials science, 3D-printing, injection molding and laser technology desirable
- Commited and creative way of working
Send your meaningful application documents by mail (only from your student email address) to Robin Basten.
Topic Announcement (German)PDF, 45 KB
Research Topics and Unsolicited Applications
We mainly offer topics from the two areas of thin film technology and mechanical micromachining and tribology. These areas are described in more detail below. If you have any questions regarding the topics, please direct them to the contacts listed. Do you have an idea or are you interested in a specific topic and would like to write a paper on it? We are always open to working on topics with students and are happy to receive unsolicited applications!
Thin Film Technology
The field of thin-film technology at IMPT covers the design and manufacture of microsystems/MEMS (sensors, actuators). The underlying effect of most of these systems is electromagnetism.
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Design
The initial system design is done by analytical and network-based methods. The detailed design is then carried out using FEM simulations. For this purpose, the multiphysics simulation tool ANSYS® is available, with which simulations e.g. in the fields of structural mechanics and electromagnetics as well as thermal and fluid dynamic simulations can be performed.
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Actuators
The actuators manufactured at the IMPT use magnetic fields to generate movement. Depending on their operating principle, the actuators can be classified as synchronous, (variable) reluctance, and hybrid actuators. Both linear and rotating micromotors are manufactured, and the use of these magnetic microactuators is being investigated, e.g. in microoptics, the manipulation of magnetic nanoparticles and implantology.
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Sensors
In addition to sensors based on electromagnetic principles, such as eddy current sensors, strain sensors, and GMR sensors (ultra-thin, for high-temperature applications), research at the IMPT focuses on modular sensors for gentelligent applications, including temperature sensors.
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Manufacture
For the production of microactuators and sensors a combination of photolithography and electrodeposition is routinely used. Using photolithography, a temporary form of photoresist is created on Si or Al2O3 substrates and filled with functional materials by electrodeposition. As functional materials Cu is used for coils and leads. NiFe45/55, NiFe81/19, CoFe and Ni are used for flow guides. Furthermore, the epoxy resin SU-8™ and polyimide are used as embedding material and material for membranes. As insulation layers of Si3N4 and SiO2 are used, which are produced by PECVD (Plasma Enhanced Chemical Vapor Deposition). For patterning, ion beam etching and lift-off are also used. The production of mechanical components (membranes, bending beams, spring structures...) is done by a combination of photolithography and etching processes. For this purpose dry etching processes (e.g. DRIE, plasma) as well as wet chemical etching processes (e.g. KOH, HF) are available.
Topics in this field may have the following main focuses:
- The fabrication and characterization of microsystems
- The development and optimization of manufacturing processes
- Layer characterizations
- Materials testing


30823 Garbsen


Mechanical Micromachining and Tribology
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Mechanical Micromachining
In the field of mechanical micro-machining, different processes are used. On the one hand, cutting-off and profile grinding processes are carried out for high-precision separation and profiling of micro-components made of ceramics, glass and silicon. On the other hand, nano-grinding and lapping processes are carried out for high-precision surface treatment of brittle-hard materials and the creation of micrographs. Furthermore, processes for the production of surfaces of high quality as well as the planarization of wafer surfaces of material combinations by polishing and chemical-mechanical polishing (CMP) are performed.
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Microtribology
In the field of microtribology, for example, wear investigations are carried out on a rotary wear measuring stand using the pin-on-disk method for flat microcontact. Furthermore, investigations on microhardness and Young's modulus as well as the representation of (adhesive) friction of thin layers by means of nanoindentation and scratch investigations are carried out. The breaking strength of coatings is determined by means of acoustic emission. Additionally, analyses of friction forces in microcontact are carried out.
Topics in this field may have the following main focus:
- Generation of highly accurate edges and microprofiles
- Optimization of a wafer holder tool for chemical mechanical polishing (CMP)
- Joining of micro components by means of soldering, eutectic and anodic bonding
- Investigation and characterization of tribological coatings