Publications – Institute of Micro Production Technology – Leibniz University Hannover

Institute of Micro Production Technology

Publications

Journals

First 1

Developments for quantum inertial navigation systems employing Bose–Einstein condensates. / Gersemann, M.; Rajagopalan, A.; Abidi, M. et al.
In: Applied physics reviews, Vol. 12, No. 3, 031306, 09.2025.

Research output: Contribution to journal › Article › Research › peer review

Nonevaporable getter-MEMS for generating UHV conditions in small volumina. / Diekmann, Leonard Frank; Kassner, Alexander; Dencker, Folke et al.
In: Journal of Vacuum Science and Technology B, Vol. 40, No. 5, 054202, 09.2022.

Research output: Contribution to journal › Article › Research › peer review

Integrated atomic quantum technologies in demanding environments: development and qualification of miniaturized optical setups and integration technologies for UHV and space operation. / Christ, Marc; Kassner, Alexander; Smol, Robert et al.
In: CEAS Space Journal, Vol. 11, No. 4, 01.12.2019, p. 561-566.

Research output: Contribution to journal › Article › Research › peer review

Magnetorelaxometry of few Fe₃O₄ nanoparticles at 77 K employing a self-compensated SQUID magnetometer. / Guillaume, A.; Scholtyssek, J.M.; Lak, A. et al.
In: Journal of Magnetism and Magnetic Materials, Vol. 408, 15.06.2016, p. 46-50.

Research output: Contribution to journal › Article › Research › peer review

Conference Papers, Conference Proceedings, Collections, Reports and Books

First 1

Technology Demonstrator for a Glass-Based Quantum System. / Pöpsel, Frederik; Kassner, Alexander; Heine, Hendrik et al.
2025. Paper presented at 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, California, United States.

Research output: Contribution to conference › Paper › Research › peer review

Diamond Coating of Diced Si Field Emitters for Enhanced Field Emission Performance. / Buchta, Aleksandra Monika; Thomas, Evan Lloyd Hunter; Kassner, Alexander et al.
2025 38th International Vacuum Nanoelectronics Conference, IVNC 2025. 2025.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Development of Glass-Based Atomchip. / Pöpsel, Frederik; Kassner, Alexander; Heinz, Jannis Ben et al.
2025. 62 - 63 Paper presented at 37th European Conference on Solid-State Transducers Eurosensors 2025, Eurosensors 2025, Wroclaw, Poland.

Research output: Contribution to conference › Paper › Research › peer review

Miniaturized Rubidium Source for Generating Vapor Phase Atoms for Magneto Optical Traps. / Koch, Jannik; Diekmann, Leonard Frank; Kassner, Alexander et al.
2024 37th International Vacuum Nanoelectronics Conference, IVNC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. (International Vacuum Nanoelectronics Conference).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Field emission current-voltage characteristics of field emitters fabricated by wafer dicing. / Buchta, Aleksandra Monika; Kassner, Alexander; Dencker, Folke et al.
Book of abstracts for the EQTC 2023. ed. / Axel Schnitger; Rebecca Hausemann; Tara Liebisch. Hannover, 2024. p. 93.

Research output: Chapter in book/report/conference proceeding › Conference abstract › Research › peer review

Modification of glass by a laser for the use in micro-electric systems and quantum devices. / Keinert, Lauritz; Koch, Jannik (Contributor); Künzler, Christoph (Contributor) et al.
Book of abstracts for the EQTC 2023. ed. / Axel Schnitger; Rebecca Husemann; Tara Liebisch. Hannover: Institutionelles Repositorium Leibniz Universität Hannover, 2024. p. 91.

Research output: Chapter in book/report/conference proceeding › Conference abstract › Research

Glass-Extraction Electrode for Field Emission Applications. / Buchta, Aleksandra M.; Kassner, Alexander; Dencker, Folke et al.
2024 37th International Vacuum Nanoelectronics Conference (IVNC). 2024. (International Vacuum Nanoelectronics Conference proceedings).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages. / Koch, Jannik; Brinkmann, Levin Marten; Kassner, Alexander et al.
2024 IEEE 74th Electronic Components and Technology Conference : (ECTC). Institute of Electrical and Electronics Engineers Inc., 2024. p. 193-200 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Novel Glass-Silicon Emitter Chip for Field Emission Applications. / Buchta, Aleksandra M.; Kassner, Alexander; Voß, Julia et al.
2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). IEEE, 2023. p. 207-209 ( International Vacuum Nanoelectronics Conference).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Micro-integrated optical systems and qualification of adhesive integration technologies for cold atomic quantum sensors. / Christ, M.; Stiekel, A.; Stölmacker, C. et al.
International Conference on Space Optics, ICSO 2022. ed. / Kyriaki Minoglou; Nikos Karafolas; Bruno Cugny. SPIE, 2023. 1277718 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12777).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Microtechnological Production of Integrated Optical Gratings Using Laser Beam Lithography for Atomic Interferometers. / de Wall, Sascha; Kassner, Alexander; Dencker, Folke et al.
Tagungsband MikroSystemTechnik Kongress 2023. 2023.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

Miniaturized quantum systems for inertial measurement units. / Kassner, A.; Diekmann, L.; Künzler, C. et al.
2023 DGON Inertial Sensors and Systems (ISS). ed. / Peter Hecker. IEEE, 2023. (International Symposium on Inertial Sensors and Systems).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems. / Droese, Niklas; Petring, Julian; Hadeler, Steffen et al.
MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. p. 763-766.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Approaches for a Solely Electroless Metallization of Through-Glass Vias. / Zawacka, Aleksandra Monika; Prediger, Maren Susanne; Kassner, Alexander et al.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE, 2022. p. 889-897 (Proceedings - Electronic Components and Technology Conference; Vol. 2022-May).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern. / de Wall, S.; Kassner, A.; Dencker, F. et al.
MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 466-468 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern. / de Wall, S.; Kassner, A.; Dencker, F. et al.
GMM-Fb. 97: Mikro-Nano-Integration. Berlin: VDE Verlag GmbH, 2020. p. 56-59 (GMM-Fachberichte).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Integrated Atomic Quantum Technologies in Demanding Environments:: Development and Qualification of Miniaturized Optical Setups and Integration Technologies for UHV and Space Operation. / Christ, M.; Kassner, Alexander; Smol, R. et al.
International Conference on Space Optics, ICSO 2018: Proceedings. ed. / Zoran Sodnik; Nikos Karafolas; Bruno Cugny. SPIE, 2019. 1118088 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11180).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten. / Kassner, Alexander; Dencker, Folke; Künzler, Christoph et al.
MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, 2019. p. 541-544.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Atom chip technology for use under UHV conditions. / Kassner, Alexander; Rechel, Mathias; Heine, Hendrik et al.
Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019. ed. / T. Otto. VDE Verlag GmbH, 2019. p. 69-75.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Next Generation Atom Chip Development. / Wurz, Marc Christopher; Papakonstantinou, Alexandros; Heine, Hendrik et al.
2018. Paper presented at DPG-Frühjahrstagungen 2018, Germany.

Research output: Contribution to conference › Paper › Research

Atom-Chip based BEC sources for compact and transportable experiments. / Wurz, Marc Christopher; Heine, Hendrik; Matthias, Jonas et al.
2017. Poster session presented at dpg-Frühjahrstagung Mainz, Mainz, Germany.

Research output: Contribution to conference › Poster › Research

Patents

First 1

Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils. / Dencker, Folke (Inventor); Wurz, Marc Christopher (Inventor); Maier, Hans Jürgen (Inventor) et al.
Deutsches Patent- und Markenamt (DPMA). Patent No.: DE102019122623A1. Feb 25, 2021.

Research output: Patent

Last Change: 12.07.24 Print