Investigations on the Influence of the Substrate’s Thickness on the Cut Quality During Dicing of thin Silicon Wafers
Categories |
Konferenz (reviewed) |
Year | 2005 |
Authors | H.H. Gatzen, G. Günzel |
Published in | Proc. euspen 5th Int. Conf. and 7th Ann. Gen. Meet. 2005, Montpellier, France, Vol. 2, pp. 589-590 |