Electroplating of Cu/Sn Layers for Hermetic Encapsulation for Vacuum Applications
| Categories |
Konferenz (reviewed) |
| Year | 2012 |
| Authors | L. Rissing, M. Wurz, S. Cvetkovic, F.-W. Bach |
| Published in | Trans. 222nd ECS Meeting, Honolulu, Hawaii, Vol. 50, No. 10, pp. 207-216 |
