Eutectic bonding of integrated circuits onto polycarbonate and poly(methyl methacrylate) by means of indium-tin and indium-bismuth
| Categories |
Zeitschriften/Aufsätze (reviewed) |
| Year | 2015 |
| Authors | Meriem Akin, Sonda Moakhar Ep Bouguecha, Juergen Becker, Lutz Rissing |
| Published in | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| DOI | 10.1109/TCPMT.2015.2420531 |
