Hybrid packaging of circuits and devices onto flexible screen printed electrical interconnects
| Categories |
Konferenz (reviewed) |
| Year | 2015 |
| Authors | Meriem Akin, Joe Corea, Simon Scott, Ana Claudia Arias, Marc Wurz, Lutz Rissing |
| Published in | SMTA Pan Pacific Microelectronics Symposium, Kauai, HI, USA |
| DOI | 10.13140/RG.2.1.2064.9763/1 |
