Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys
| Categories |
Konferenz (reviewed) |
| Year | 2015 |
| Authors | D. Klaas, A. Wienecke, M.C. Wurz, L. Rissing, P. Freytag, H.J. Maier |
| Published in | SMTA Pan Pacific Microelectronics Symposium, Kauai, HI, USA |
