Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process
| Categories |
Konferenz (reviewed) |
| Year | 2017 |
| Authors | Long Y, Dencker F, Isaak A, Li C, Schneider F, Hermsdor J, Wurz MC, Twiefel J, Wallaschek J |
| Published in | IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, p. 203-206 |
Description
