Visualization of Oxide Removal during Ultrasonic Wire Bonding Process
Categories |
Konferenz (reviewed) |
Year | 2018 |
Authors | Long Y, Dencker F, Isaak A, Schneider F, Hermsdor J, Wurz MC, Twiefel J |
Published in | IEEE Electronics Packaging Technology Conference (EPTC), Singapore, p. 1-4 |