Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process
| Categories |
Konferenz (reviewed) |
| Year | 2017 |
| Authors | Long Y, Dencker F, Schneider F, Emde B, Li C, Hermsdorf J, Wurz MC, Twiefel J |
| Published in | Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 |
| ISBN | 978-150904368-2 |
| DOI | 10.1109/EPTC.2016.7861512 |
