Atom Chip technology for use under UHV conditions
| Categories |
Konferenz |
| Year | 2019 |
| Authors | Kassner A, Rechel M, Heine H, Herr W, Christ M, Krutzik M, Rasel EM, Wurz MC |
| Published in | Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, Barcelona, Spain, 2019, pp. 69-75 |
| ISBN | 978-3-8007-4919-5 |
| More info | |
