Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process
| Categories |
Konferenz (reviewed) |
| Year | 2021 |
| Authors | S. Hadeler, R. Ottermann, Y. Long, F. Dencker, M.C. Wurz, J. Twiefel |
| Published in | IEEE Electronics Packaging Technology Conference (EPTC) |
