Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding
| Categories |
Konferenz (reviewed) |
| Year | 2020 |
| Authors | Arndt M, Dencker F, Wurz MC |
| Published in | IEEE 70th Electronic Comp. and Techn. Conf. (ECTC) |
Description
In this paper, the process chain of a novel 4x3 force sensor array prototype for in-situ detection of the stress distribution during ultrasonic (US) wire bonding process is demonstrated. The sensor is based on d15 lead zirconate titanate (PZT) 255 ceramic, which is cut into individual columns by precision dicing. Polyimide is then filled among the columns to constitute a new PZT/polyimide hybrid sensor platform. Each PZT column is responsible for the measurement of the local tangential force at the wire/substrate interface during US wire bonding.
| DOI | 10.1109/ECTC32862.2020.00053 |
