Publications

Journals

Showing results 1 - 20 out of 20

Detailed characterisation of batch-manufactured flexible micro-grinding tools for electrochemical assisted grinding of copper surfaces. / Steinhoff, Lukas; Ottermann, Rico; Dencker, Folke et al.
In: The International Journal of Advanced Manufacturing Technology, Vol. 128, No. 5-6, 09.2023, p. 2301-2310.

Research output: Contribution to journal › Article › Research › peer review

Characterization of the tribologically relevant cover layers formed on copper in oxygen and oxygen-free conditions. / Raumel, Selina; Barienti, Khemais; Luu, Hoang Thien et al.
In: Friction, Vol. 11, No. 8, 08.2023, p. 1505–1521.

Research output: Contribution to journal › Article › Research › peer review

Soliton compression and supercontinuum spectra in nonlinear diamond photonics. / Melchert, O.; Kinnewig, S.; Dencker, F. et al.
In: Diamond and Related Materials, Vol. 136, 109939, 06.2023.

Research output: Contribution to journal › Article › Research › peer review

Application of batch manufactured flexible micro-grinding tools on copper and oxidized copper surfaces. / Steinhoff, Lukas; Dencker, Folke; Wurz, Marc Christopher.
In: Tribologie und Schmierungstechnik, Vol. 70, No. 1, 27.03.2023, p. 5-10.

Research output: Contribution to journal › Article › Research › peer review

Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array. / Long, Yangyang; Arndt, Matthias; Sun, Chen et al.
In: Journal of Materials Processing Technology, Vol. 312, 117826, 03.2023.

Research output: Contribution to journal › Article › Research › peer review

Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process. / Wittek, Christian-G R.; Steinhoff, Lukas; Raumel, Selina et al.
In: Micromachines, Vol. 14, No. 3, 580, 28.02.2023.

Research output: Contribution to journal › Article › Research › peer review

Degeneration Effects of Thin-Film Sensors after Critical Load Conditions of Machine Components. / Ottermann, Rico; Steppeler, Tobias; Dencker, Folke et al.
In: Machines, Vol. 10, No. 10, 870, 27.09.2022.

Research output: Contribution to journal › Article › Research › peer review

Impact of surface texture on ultrasonic wire bonding process. / Long, Yangyang; Arndt, Matthias; Dencker, Folke et al.
In: Journal of Materials Research and Technology, Vol. 20, 09.2022, p. 1828-1838.

Research output: Contribution to journal › Article › Research › peer review

Nonevaporable getter-MEMS for generating UHV conditions in small volumina. / Diekmann, Leonard Frank; Kassner, Alexander; Dencker, Folke et al.
In: Journal of Vacuum Science and Technology B, Vol. 40, No. 5, 054202, 09.2022.

Research output: Contribution to journal › Article › Research › peer review

High temperature nanoindentation of iron: Experimental and computational study. / Khvan, T.; Noels, L.; Terentyev, D. et al.
In: Journal of nuclear materials, Vol. 567, 153815, 15.08.2022.

Research output: Contribution to journal › Article › Research › peer review

Nanoindentation in alumina coated Al: Molecular dynamics simulations and experiments. / Luu, Hoang Thien; Raumel, Selina; Dencker, Folke et al.
In: Surface and Coatings Technology, Vol. 437, 128342, 15.05.2022.

Research output: Contribution to journal › Article › Research › peer review

Residual Stresses from Incremental Hole Drilling Using Directly Deposited Thin Film Strain Gauges. / Heikebrügge, S.; Ottermann, R.; Breidenstein, B. et al.
In: Experimental mechanics, Vol. 62, No. 4, 04.2022, p. 701-713.

Research output: Contribution to journal › Article › Research › peer review

Einfluss von Silan-dotierten Umgebungsatmosphären auf tribologischen Eigenschaften von Titan. / Raumel, Selina; Barienti, Khemais; Dencker, Folke et al.
In: Tribologie und Schmierungstechnik, Vol. 68, No. 1, 22.03.2021, p. 5-13.

Research output: Contribution to journal › Article › Research › peer review

Development, characterisation and high-temperature suitability of thin-film strain gauges directly deposited with a new sputter coating system. / Klaas, Daniel; Ottermann, Rico; Dencker, Folke et al.
In: Sensors (Switzerland), Vol. 20, No. 11, 3294, 10.06.2020, p. 1-15.

Research output: Contribution to journal › Article › Research › peer review

Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding. / Long, Yangyang; Dencker, Folke; Isaak, Andreas et al.
In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology, Vol. 236-237, 29.11.2018, p. 189-196.

Research output: Contribution to journal › Article › Research › peer review

Self-cleaning mechanisms in ultrasonic bonding of Al wire. / Long, Yangyang; Dencker, Folke; Isaak, Andreas et al.
In: Journal of Materials Processing Technology, Vol. 258, 08.2018, p. 58-66.

Research output: Contribution to journal › Article › Research › peer review

Klimt artwork: red-pigment material investigation by backscattering Fe-57 Mössbauer spectroscopy, SEM and p-XRF. / Lehmann, Robert; Wengerowsky, Dagmar; Schmidt, Heike J. et al.
In: Science and Technology of Archaeological Research, Vol. 3, No. 2, 15.12.2017, p. 450-455.

Research output: Contribution to journal › Article › Research › peer review

A silicone fiber coating as approach for the reduction of fibroblast growth on implant electrodes. / Dencker, Folke; Dreyer, Lutz; Müller, Dietrich et al.
In: Journal of Biomedical Materials Research - Part B Applied Biomaterials, Vol. 105, No. 8, 11.2017, p. 2574-2580.

Research output: Contribution to journal › Article › Research › peer review

Klimt artwork (Part II): material investigation by backscattering Fe-57 Mössbauer- and Raman- spectroscopy, SEM and p-XRF. / Costa, B. F.O.; Lehmann, R.; Wengerowsky, D. et al.
In: Hyperfine Interactions, Vol. 237, No. 1, 92, 12.2016.

Research output: Contribution to journal › Article › Research › peer review

Conference Papers, Conference Proceedings, Collections, Reports and Books

Showing results 1 - 36 out of 36

Manufacturing of a Reluctance Actuator for Use as a Hearing Implant in the Middle Ear. / Müller, Eileen; Adamscheck, Marco (Contributor); Fischer, Eike Christian (Contributor) et al.
2023. Poster session presented at MikroSystemTechnik Kongress 2023, Dresden, Germany.

Research output: Contribution to conference › Poster › Research

Direct Sensor Integration on the Raceway of Roller Bearings. / Pape, Florian; Konopka, Dennis; Coors, Timm et al.
Gesellschaft für Tribologie e.V. (GfT), 2023. 9 p.

Research output: Book/Report › Conference proceeding › Research

Novel Glass-Silicon Emitter Chip for Field Emission Applications. / Buchta, Aleksandra M.; Kassner, Alexander; Voß, Julia et al.
2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). IEEE, 2023. p. 207-209 ( International Vacuum Nanoelectronics Conference).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Force sensing linear rolling guides based on modified metal strain gauges. / Denkena, Berend; Klemme, Heinrich; Kowalke, Dennis et al.
2023. Paper presented at 23rd International Conference of the European Society for Precision Engineering and Nanotechnology (euspen), Copenhagen, Denmark.

Research output: Contribution to conference › Paper › Research › peer review

Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters. / Hadeler, Steffen; Long, Yangyang; Ottermann, Rico et al.
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., 2023. p. 676-681 (Proceedings - Electronic Components Conference).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor. / Fünfkirchler, T.; Arndt, M.; Hübner, S. et al.
Lecture Notes in Production Engineering. Springer Nature, 2023. p. 111-121 (Lecture Notes in Production Engineering; Vol. Part F1163).

Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review

Advancements in monitoring of tribological stress in bearings using thin-film strain gauges. / Konopka, Dennis; Steppeler, Tobias; Ottermann, Rico et al.
2023. 1623-1634 Paper presented at 10th ECCOMAS Thematic Conference on Smart Structures and Materials.

Research output: Contribution to conference › Paper › Research › peer review

Influence of oxide layers on the mechanical properties of copper. / Raumel, Selina; Wolf, Anna-Marleen; Dencker, Folke et al.
Tagungsband, 5. Symposium Materialtechnik : Fortschrittbericht der Materialforschung und Werkstofftechnik . Clausthaler Zentrum für Materialtechnik, 2023. p. 149-159 (Fortschrittsberichte der Materialforschung und Werkstofftechnik; Vol. 12).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Miniaturized quantum systems for inertial measurement units. / Kassner, A.; Diekmann, L.; Künzler, C. et al.
2023 DGON Inertial Sensors and Systems (ISS). ed. / Peter Hecker. IEEE, 2023. (International Symposium on Inertial Sensors and Systems).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing Processes. / Kamrani, Sara; Ottermann, Rico; Dencker, Folke et al.
SMSI 2023. AMA Association for Sensors and Measurement , 2023. p. 284 -285.

Research output: Chapter in book/report/conference proceeding › Other contribution in a book, report, anthology or conference proceeding › Research

Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology. / Bierwirth, Tim Nils; Dencker, Folke; Fischer, Eike Christian et al.
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. p. 129-133 (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

Approaches for a Solely Electroless Metallization of Through-Glass Vias. / Zawacka, Aleksandra Monika; Prediger, Maren Susanne; Kassner, Alexander et al.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE, 2022. p. 889-897 (Proceedings - Electronic Components and Technology Conference; Vol. 2022-May).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

In Situ Resistance Trimming of Directly Deposited Thin-Film Strain Gauges. / Ottermann, Rico; Zhang, Shuowen; Denkena, Berend et al.
2022 IEEE Sensors, SENSORS 2022 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (Proceedings of IEEE Sensors; Vol. 2022-October).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Production and characterisation of batch manufactured flexible micro-grinding tools for finishing metallic surfaces. / Steinhoff, Lukas; Dencker, Folke; Wurz, Marc Christopher.
European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022. ed. / Richard K. Leach; A. Akrofi-Ayesu; C. Nisbet; Dishi Phillips. euspen, 2022. p. 77-80 (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Anisotropic Magneto-Resistive Sensor Effect based Sensor using Daisy Chain on Polyether Ether Ketone Substrate. / De Wall, Sascha; Bengsch, Sebastian; Fischer, Eike et al.
2021 IEEE Sensors. Institute of Electrical and Electronics Engineers Inc., 2021. (Proceedings of IEEE Sensors; Vol. 2021-October).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Directly Deposited Thin-Film Strain Gauges on Curved Metallic Surfaces. / Ottermann, Rico; Klaas, Daniel; Dencker, Folke et al.
2021 IEEE Sensors, SENSORS 2021 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. (Proceedings of IEEE Sensors; Vol. 2021-October).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Direktabgeschiedene Dünnfilm-Dehnungsmessstreifen für erhöhte Temperaturen. / Ottermann, Rico; Klaas, Daniel; Dencker, Folke Enno et al.
MikroSystemTechnik Kongress 2021: Proceedings. Berlin: VDE Verlag GmbH, 2021. p. 315-316.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Direktabgeschiedene Dünnfilmsensorik mithilfe einer neuartigen Beschichtungsanlage. / Ottermann, Rico; Klaas, Daniel; Dencker, Folke Enno et al.
27. NDVaK-Kolloquium. Dresden, 2021.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach. / Fischer, Eike Christian; Bierwirth, Tim Nils; Dencker, Folke et al.
MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 483-486 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

Investigation of tribologically relevant surface layers formed on non-ferrous metals in oxygen-free conditions. / Raumel, Selina; Dencker, Folke; Wurz, Marc.
2021. Abstract from European Symposium on Friction, Wear and Wear Protection .

Research output: Contribution to conference › Abstract › Research

Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process. / Hadeler, Steffen; Seefisch, Henning; Ottermann, Rico et al.
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., 2021. p. 288-291.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern. / de Wall, S.; Kassner, A.; Dencker, F. et al.
MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 466-468 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses. / Arndt, Matthias; Wurz, Marc Christopher; Dencker, Folke et al.
MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 742-745 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated Temperatures. / Ottermann, Rico; Klaas, Daniel; Dencker, Folke et al.
IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. 9278661.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern. / de Wall, S.; Kassner, A.; Dencker, F. et al.
GMM-Fb. 97: Mikro-Nano-Integration. Berlin: VDE Verlag GmbH, 2020. p. 56-59 (GMM-Fachberichte).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding. / Arndt, Matthias; Long, Yangyang; Dencker, Folke et al.
Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 276-283 9159495 (Proceedings - Electronic Components and Technology Conference; Vol. 2020-June).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications. / Arndt, Matthias; Dencker, Folke; Wurz, Marc Christopher.
2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8956948 (Proceedings of IEEE Sensors; Vol. 2019-October).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten. / Kassner, Alexander; Dencker, Folke; Künzler, Christoph et al.
MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, 2019. p. 541-544.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren. / Arndt, Matthias; Dencker, Folke; Wurz, Marc Christopher.
MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, 2019. p. 673-676.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process. / Long, Yangyang; Dencker, Folke; Isaak, Andreas et al.
2017 IEEE CPMT Symposium Japan (ICSJ). Institute of Electrical and Electronics Engineers Inc., 2017. p. 203-206.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Visualization of oxide removal during ultrasonic wire bonding process. / Long, Yangyang; Dencker, Folke; Isaak, Andreas et al.
2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-4.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process. / Long, Yangyang; Dencker, Folke; Schneider, Friedrich et al.
Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 405-410 7861512.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Electrical feed through for tool integrated high temperature applications. / Dencker, Folke; Kolodziejczyk, Felix; Wurz, Marc Christopher.
International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. Mesago Messe Frankfurt GmbH, 2017. p. 50-56 (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Hot stamping process reliability – Innovative sensor technology for inline quality assurance. / Wurz, Marc Christopher; Behrens, Bernd-Arno; Hübner, Sven et al.
Conference Strategies in Car Body Engineering. 2017.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

Press hardening tool integrated thin film temperature sensor. / Dencker, Folke; Schlenkrich, A.; Wurz, Marc Christopher.
Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. euspen, 2017. p. 349-350 (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

An application report: Protective thin film layers for high temperature sensor technology. / Dencker, Folke; Wurz, Marc; Dubrovskiy, Sergey et al.
Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016. ed. / S. Shaposhnikov. Institute of Electrical and Electronics Engineers Inc., 2016. p. 32-36 7448110.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Patents

Showing results 1 - 3 out of 3

Verfahren zur Herstellung von Diamantspitzen. / Dencker, Folke (Inventor); Wurz, Marc Christopher (Inventor); Maier, Hans Jürgen (Inventor).
Patent No.: DE102019213043. Mar 04, 2021.

Research output: Patent

Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils. / Dencker, Folke (Inventor); Wurz, Marc Christopher (Inventor); Maier, Hans Jürgen (Inventor) et al.
Patent No.: DE102019122623. Feb 25, 2021.

Research output: Patent

Kohlenstofffaser mit hoher Leitfähigkeit und Herstellungsverfahren hierfür. / Renz, Franz (Inventor); Sindelar, Ralf (Inventor); Tegenkamp, Christoph (Inventor) et al.
Patent No.: WO2017158140. Sept 21, 2017.

Research output: Patent

Miscellaneous

Showing results -99 - 0 out of 0