Publications

Journals

Showing results 1 - 2 out of 2

Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array. / Long, Yangyang; Arndt, Matthias; Sun, Chen et al.
In: Journal of Materials Processing Technology, Vol. 312, 117826, 03.2023.

Research output: Contribution to journalArticleResearchpeer review

Impact of surface texture on ultrasonic wire bonding process. / Long, Yangyang; Arndt, Matthias; Dencker, Folke et al.
In: Journal of Materials Research and Technology, Vol. 20, 09.2022, p. 1828-1838.

Research output: Contribution to journalArticleResearchpeer review

Conference Papers, Conference Proceedings, Collections, Reports and Books

Showing results 1 - 8 out of 8

Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor. / Fünfkirchler, T.; Arndt, M.; Hübner, S. et al.
Lecture Notes in Production Engineering. Springer Nature, 2023. p. 111-121 (Lecture Notes in Production Engineering; Vol. Part F1163).

Research output: Chapter in book/report/conference proceedingContribution to book/anthologyResearchpeer review

Tiefziehen mit integrierter induktiver Flanscheinzugssensorik in Dünnschichttechnik: Schlussbericht vom 28.02.2022 zu IGF-Vorhaben Nr. 20468 N : Berichtszeitraum: 01.03.2019 bis 31.08.2021. / Fünfkirchler, Timo; Pfeffer, Chris; Micke-Camuz, Moritz et al.
Düsseldorf: Forschungsvereinigung Stahlanwendung e.V. (FOSTA), 2022. (Forschung für die Praxis / Forschungsvereinigung Stahlanwendung e.V; Vol. 1217).

Research output: Book/ReportOther reportResearch

Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses. / Arndt, Matthias; Wurz, Marc Christopher; Dencker, Folke et al.
MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 742-745 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding. / Arndt, Matthias; Long, Yangyang; Dencker, Folke et al.
Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 276-283 9159495 (Proceedings - Electronic Components and Technology Conference; Vol. 2020-June).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Optical Platform for Highly Precise Optical Components. / Bengsch, Sebastian; Fischer, Eike; De Wall, Sascha et al.
Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 2191-2196 9159477 (Proceedings - Electronic Components and Technology Conference; Vol. 2020-June).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications. / Arndt, Matthias; Dencker, Folke; Wurz, Marc Christopher.
2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8956948 (Proceedings of IEEE Sensors; Vol. 2019-October).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren. / Arndt, Matthias; Dencker, Folke; Wurz, Marc Christopher.
MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, 2019. p. 673-676.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten. / Rechel, Mathias; Taptimthong, Piriya; Arndt, Matthias et al.
MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, 2017. p. 313-316 (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Miscellaneous

Showing results 1 - 1 out of 1

Entwicklung eines piezoelektrischen Kraftsensor-Arrays. / Arndt, Matthias.
In: phi – Produktionstechnik Hannover informiert, Vol. 34, 03.2022.

Research output: Contribution to specialist publicationContribution in popular science journalTransfer