PUBLIKATIONEN

Zeitschriften/Aufsätze (reviewed)

  • Klaas D, Ottermann R, Dencker F, Wurz MC (2020): Development, Characterisation and High-Temperature Suitability of Thin-Film Strain Gauges Directly Deposited with a New Sputter Coating SystemMDPI Sensors
    DOI: 10.3390/s20113294
  • Long Y, Dencker F, Isaak A, Hermsdorf J, Wurz MC, Twiefel J (2018): Self-Cleaning Mechanisms in Ultrasonic Bonding of Al WireJournal of Materials Processing Technology, Vol 258 Weitere Informationen
    DOI: 10.1016/j.jmatprotec.2018.03.016
  • Long Y, Dencker F, Isaak A, Li C, Schneider F, Hermsdorf J, Wurz MC, Twiefel J, Wallaschek J (2018): Revealing of ultrasonic wire bonding mechanisms via metal-glass bondingMaterials Science and Engineering B: Solid-State Materials for Advanced Technology, Vol 236-237
    DOI: 10.1016/j.mseb.2018.11.010
  • Dencker F, Dreyer L, Müller D, Zernetsch H, Paasche G, Sindelar R, Glasmacher B (2017): A silicone fiber coating as approach for the reduction of fibroblast growth on implant electrodesJournal of Biomedical Materials Research - Part B Applied Biomaterials, Vol 105(8), 2017
    DOI: 10.1002/jbm.b.33798
  • Lehmann R, Wengerowsky D, Schmidt HJ, Kumar M, Niebur A, Costa BFO, Dencker F, Klingelhöfer G, Sindelar R, Renz F (2017): Klimt artwork: red-pigment material investigation by backscattering Fe-57 Mössbauer spectroscopy, SEM and p-XRFScience and Technology of Archaeological Research, Vol 3(2), 2017
    DOI: 10.1080/20548923.2017.1399332
  • B. F. O. Costa BFO, Lehmann R, Wengerowsky D, Blumers M, Sansano A, Rull F, Schmidt H-J, Dencker F, Niebur A, Klingelhöfer G, Sindelar R, Renz F (2016): Klimt artwork (Part II): material investigation by backscattering Fe-57 Mössbauer- and Raman- spectroscopy, SEM and p-XRFHyperfine Interactions, Vol 237(1), 2016 Weitere Informationen
    DOI: 10.1007/s10751-016-1263-z

Konferenz (reviewed)

  • Arndt M, Dencker F, Wurz MC (2020): Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire BondingIEEE 70th Electronic Comp. and Techn. Conf. (ECTC)
    DOI: 10.1109/ECTC32862.2020.00053
  • R. Ottermann, D. Klaas, F. Dencker, D. Hoheisel, P. Rottengatter, T. Kruspe, M.C. Wurz (2020): Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated TemperaturesIEEE Sensors 2020
    DOI: 10.1109/SENSORS47125.2020.9278661
  • Raumel S, Barienti K, Dencker F, Wurz MC (2020): Einfluss von Silan-dotierten Umgebungsatmosphären auf die tribologischen Eigenschaften von Titan61. Tribologie-Fachtagung 2020
  • S. de Wall, A. Kassner, F. Dencker, C. Künzler, H. Heine, W. Herr, M. Christ, M. Krutzik, E. M. Rasel, M. C. Wurz (2020): Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in AtominterferometernMikro-Nano-Integration - 8. GMM-Workshop, 2020
  • Arndt M, Dencker F, Wurz MC (2019): Novel Eddy-Current Sensor For Industrial Deep-Drawing ApplicationsIEEE Sensors 2019
    DOI: 10.1109/SENSORS43011.2019.8956948
  • Long Y, Dencker F, Isaak A, Schneider F, Hermsdor J, Wurz MC, Twiefel J (2018): Visualization of Oxide Removal during Ultrasonic Wire Bonding ProcessIEEE Electronics Packaging Technology Conference (EPTC), Singapore, p. 1-4
  • Dencker F, Kolodziejczyk F, Wurz MC (2017): Electrical feed through for tool integrated high temperature applicationsInternational Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
    ISBN: 978-395735057-2
  • Dencker F, Schlenkrich A, Wurz MC (2017): Press hardening tool integrated thin film temperature sensorProceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017
    ISBN: 978-099577510-7
  • Long Y, Dencker F, Isaak A, Li C, Schneider F, Hermsdor J, Wurz MC, Twiefel J, Wallaschek J (2017): Analysis of the Wire/Substrate Interface during Ultrasonic Bonding ProcessIEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, p. 203-206
  • Long Y, Dencker F, Schneider F, Emde B, Li C, Hermsdorf J, Wurz MC, Twiefel J (2017): Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding processProceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
    DOI: 10.1109/EPTC.2016.7861512
    ISBN: 978-150904368-2
  • Dencker F, Wurz MC, Dubrovskiy S, Koroleva E (2016): An application report: Protective thin film layers for high temperature sensor technologyProceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016
    DOI: 10.1109/EIConRusNW.2016.7448110
    ISBN: 978-150900445-4

Konferenz

  • Arndt M, Dencker F, Wurz MC (2019): Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven SensorenMikroSystemTechnik Kongress 2019
    ISBN: 978-3-8007-5090-0
  • Kassner A, Künzler C, Dencker F, Christ M, Heine H, Herr W, Krutzik M, Rasel EM, Wurz MC (2019): Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-KondensatenMikroSystemTechnik Kongress 2019
    ISBN: ISBN 978-3-8007-5090-0
  • Behrens BA, Hübner S, Niemeyer H, Moritz J, Pfeffer C, Wölki K, Dencker F, Wurz MC, Wolter B, Müller T, Niese F (2017): Hot stamping process reliability – Innovative sensor technology for inline quality assuranceConference Strategies in Car Body Engineering, 22-23 March 2017, Bad Nauheim