Visualization of Oxide Removal during Ultrasonic Wire Bonding Process
| Kategorien |
Konferenz (reviewed) |
| Jahr | 2018 |
| Autorinnen/Autoren | Long Y, Dencker F, Isaak A, Schneider F, Hermsdor J, Wurz MC, Twiefel J |
| Veröffentlicht in | IEEE Electronics Packaging Technology Conference (EPTC), Singapore, p. 1-4 |
