Approaches for a Solely Electroless Metallization of Through-Glass Vias

Kategorien Conferences (reviewed)
Jahr 2022
Autoren A. M. Zawacka, M. S. Prediger, A. Kassner, F. Dencker, M. Wurz
Veröffentlicht in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
DOI 10.1109/ECTC51906.2022.00145