Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process
| Kategorien |
Konferenz (reviewed) |
| Jahr | 2021 |
| Autoren | S. Hadeler, R. Ottermann, Y. Long, F. Dencker, M.C. Wurz, J. Twiefel |
| Veröffentlicht in | IEEE Electronics Packaging Technology Conference (EPTC) |
