Dicing of thin stacked wafer packages
| Kategorien |
Konferenz (reviewed) |
| Jahr | 2004 |
| Autoren | H.H. Gatzen, G. Günzel |
| Veröffentlicht in | Proc. 7th Int. Symposium on Advances in Abrasive Technology 2004, Bursa, Turkey, pp. 443-446 |
