ForschungPublikationen
Improved Dicing Method for Thin Silicon Wafers

Improved Dicing Method for Thin Silicon Wafers

Kategorien Konferenz (reviewed)
Jahr 2004
Autoren H.H. Gatzen, G. Günzel
Veröffentlicht in Proc. 4th euspen Int. Conf. and 6th Ann. Gen. Meet. 2004, Glasgow, UK, pp. 143-144