ForschungPublikationen
Ultra-precision Dicing and Wire Sawing of Silicon Carbide (SiC)

Ultra-precision Dicing and Wire Sawing of Silicon Carbide (SiC)

Kategorien Zeitschriften/Aufsätze
Jahr 2011
Autoren S. Cvetkovic, C. Morsbach, L. Rissing
Veröffentlicht in “Microelectronic Engineering” Journal (spec. issue), Proc. 36th International Conf. on Micro&Nanoengineering (MNE10), Genoa, Italy, Vol.88, Nr. 9, 2011, pp. 2500-2504