ForschungPublikationen
Electroplating of Cu/Sn Layers for Hermetic Encapsulation for Vacuum Applications

Electroplating of Cu/Sn Layers for Hermetic Encapsulation for Vacuum Applications

Kategorien Konferenz (reviewed)
Jahr 2012
Autoren L. Rissing, M. Wurz, S. Cvetkovic, F.-W. Bach
Veröffentlicht in Trans. 222nd ECS Meeting, Honolulu, Hawaii, Vol. 50, No. 10, pp. 207-216