Institut für Mikroproduktionstechnik Forschung Publikationen
Technology Development for Packaging of the GMR-Sensor via Eutectic Bonding

Investigations on Strain Behaviour of Polymer Substrates during a Separation Process

Kategorien Konferenz (reviewed)
Jahr 2014
Autoren L. Jogschies, J. Heimann, D. Klaas, L. Rissing
Veröffentlicht in 2nd International Conference on System-Integrated Intelligence: Challenges for Product and Production Engineering, Procedia Technology, Vol. 15, 2014, pp. 221–229
DOI 10.1016/j.protcy.2014.09.075