Institut für Mikroproduktionstechnik Forschung Publikationen
Technology Development for Packaging of the GMR-Sensor via Eutectic Bonding

Investigations on the Removal Mechanisms of Diverse Alumina Based Polishing Slurries for Chemical Mechanical Polishing of Electro-plated NiFe 45/55

Kategorien Konferenz (reviewed)
Jahr 2013
Autoren J. Rittinger, S. Cvetkovic, L. Rissing
Veröffentlicht in Microelectronic Engineering Journal, (spec. issue), Proc. 38th Int. Conf. on Micro & Nanoengineering, Toulouse, France