Institut für Mikroproduktionstechnik Forschung Publikationen
Technology Development for Packaging of the GMR-Sensor via Eutectic Bonding

Relationship between Removal Rate and Friction Force of a CMP Process for MEMS

Kategorien Konferenz (reviewed)
Jahr 2009
Autoren S. Cvetkovic, D. Miletic, H.H. Gatzen
Veröffentlicht in Proc. euspen 9th Int. Conf. 2009, San Sebastian, Spain, Vol. 2, pp. 499-502