Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems

verfasst von

Niklas Droese, Julian Petring, Steffen Hadeler, Alexander Kassner, Folke Dencker, Marc C. Wurz

Abstract

The feasibility to achieve and maintain ultra-high vacuum (UHV) on chip-scale packages represents a major step towards the miniaturization of affordable and pocket-sized quantum systems. Various components, which are essential for these systems, are under research at the Institute of Micro Production Technology, including a hermetic micro-fabricated vacuum package. To achieve this, a UHV Bonder was developed and set up in its first initial iteration, capable of capsulating under UHV conditions and thereby providing a promising outlook for an integration of said components inside the package. A chamber base pressure of 8*10^-9 mbar was reached without a bakeout before bonding and Au-Au samples have been successfully bonded at low temperatures (200°C) with an applied pressure of 600 N. Vacuum characteristics were analyzed using a residual gas analyzer (RGA), while the bonded samples were characterized through shear tests and examined with SEM.

Organisationseinheit(en)

Institut für Mikroproduktionstechnik

Typ

Aufsatz in Konferenzband

Seiten

763-766

Anzahl der Seiten

4

Publikationsdatum

2023

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik, Elektronische, optische und magnetische Materialien, Oberflächen, Beschichtungen und Folien, Physik der kondensierten Materie, Atom- und Molekularphysik sowie Optik

Elektronische Version(en)

https://doi.org/10.15488/18549 (Zugang: Offen)