Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

verfasst von

Yangyang Long, Folke Dencker, Friedrich Schneider, Benjamin Emde, Chun Li, Jörg Hermsdorf, Marc Christopher Wurz, Jens Twiefel

Abstract

As an inevitable step during ultrasonic bonding of aluminum or copper materials, the removal of oxides that prevent the bond formation is essential for obtaining high quality. Nevertheless, the oxides removal process is still unclear after tens of years' application of ultrasonic bonding. In this project, the removal mechanism was investigated via the analysis of an artificially coated oxide layer. The oxide removal process was observed in real-time by a high-speed observation system and the oxides distribution after the bonding process was observed under an electron microscope. The results show that during the bonding process, the detached oxides first agglomerate into larger particles and were then pressed outside of the contact area. The areas of the particles were counted and fit to a lognormal distribution.

Organisationseinheit(en)

Institut für Dynamik und Schwingungen
Institut für Mikroproduktionstechnik

Externe Organisation(en)

Laser Zentrum Hannover e.V. (LZH)

Typ

Aufsatz in Konferenzband

Seiten

405-410

Anzahl der Seiten

6

Publikationsdatum

21.02.2017

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik, Keramische und Verbundwerkstoffe, Elektronische, optische und magnetische Materialien, Metalle und Legierungen

Elektronische Version(en)

https://doi.org/10.1109/EPTC.2016.7861512 (Zugang: Geschlossen)