Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding
- verfasst von
- Matthias Arndt, Yangyang Long, Chengyan Hu, Folke Dencker, Jens Twiefel, Marc Christopher Wurz
- Abstract
Ultrasonic (US) wire bonding is a very complex process. Different mechanisms occur at different locations of the bonding interface in a very short time making a spatially resolved investigation of the process extremely difficult. As a result the local mechanisms stay unclear. Therefore, a novel 3×4 force sensor array has been developed for the in-situ investigations of the ultrasonic wire bonding process. The array is based on the piezoelectric ceramic lead zirconate titanate (PZT), which is first divided into individual sensor columns via precision dicing and then filled with a polymer. Each of these columns acts as a single sensor of the array with a sensing area of 360×160 μm2. The array was used to measure the local tangential forces, which occur at the contact region between the wire and the substrate during the bonding process. To be able to detect the local effects even more precisely a sensor array with smaller elements has been developed recently. Building on the existing design, the new version of the array now features 4×12 sensors with a sensing area of 100×100 μm2 while maintaining the same total size of around 1600×500 µm2 as before. This work presents the manufacturing and characterization of the new sensor array, which promises in-situ measurements of the bonding process with enhanced resolution.
- Organisationseinheit(en)
-
Institut für Mikroproduktionstechnik
Institut für Dynamik und Schwingungen
- Typ
- Aufsatz in Konferenzband
- Seiten
- 462-465
- Anzahl der Seiten
- 4
- Publikationsdatum
- 2023
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Elektrotechnik und Elektronik, Elektronische, optische und magnetische Materialien, Oberflächen, Beschichtungen und Folien, Physik der kondensierten Materie, Atom- und Molekularphysik sowie Optik
- Elektronische Version(en)
-
https://doi.org/10.15488/18555 (Zugang:
Offen)