Micro-integrated optical systems and qualification of adhesive integration technologies for cold atomic quantum sensors
- verfasst von
- M. Christ, A. Stiekel, C. Stölmacker, C. Zimmermann, A. Kassner, M. Wurz, M. Krutzik
- Abstract
Cold atom based quantum sensors require robust and miniaturized optical systems for applications on mobile platforms. A micro-integrated optical system (volume ∼25 mL) for trapping and manipulation of neutral atoms is presented. This setup focuses and precisely overlaps two high power laser beams (1064 nm, up to 2 W total, wR = 34 µm) launched via a single-mode, polarization maintaining optical fiber, thereby realizing a crossed beam optical dipole trap (ODT). Adhesive bonding is qualified in application relevant geometries and material systems of micro-integrated optical systems for application on mobile platforms or space. Fused silica test blocks (bond area 2 × 4 mm2) are bonded with four different adhesives on silicon wafers. Theses samples are aged by thermal cycling (up to −55 °C to 150 °C) and/or gamma-radiation (10 000 mSv) and subsequently the bond strength is evaluated by die shear testing according to MIL-STD-883L. The influence of the environmental aging on the bond strength is presented, the failure mode and the influence of fillets discussed. In addition, the effects of plasma cleaning on the bond strength in this geometry is presented.
- Organisationseinheit(en)
-
Quantentechnologien
Institut für Mikroproduktionstechnik
- Externe Organisation(en)
-
Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik (FBH)
Humboldt-Universität zu Berlin
- Typ
- Aufsatz in Konferenzband
- Publikationsdatum
- 12.07.2023
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Elektronische, optische und magnetische Materialien, Physik der kondensierten Materie, Angewandte Informatik, Angewandte Mathematik, Elektrotechnik und Elektronik
- Elektronische Version(en)
-
https://doi.org/10.1117/12.2689275 (Zugang:
Offen)
