Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix

verfasst von

Sebastian Bengsch, Ulrich Giese, Eike Fischer, Marc Christopher Wurz

Abstract

The integration of sensor-systems into elastomer bodies or onto flexible surfaces is a challenging task. Therefore, a new approach has been developed and investigated to create thin-film-based structures via PVD (physical vapor deposition) processes on water-soluble substrates such as polyvinyl-alcohol (PVA) and subsequently transferring the sensor structures onto unvulcanized rubber substrates. A contacting method using conductive polymer composites creates a reliable technique to electrically contact transferred thin film layers within an elastomer sandwich matrix.

Organisationseinheit(en)

Institut für Mikroproduktionstechnik

Externe Organisation(en)

Deutsches Institut für Kautschuktechnologie e.V. (DIK)

Typ

Aufsatz in Konferenzband

Publikationsdatum

2020

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1109/SENSORS47125.2020.9278876 (Zugang: Geschlossen)