Optical Platform for Highly Precise Optical Components

verfasst von

Sebastian Bengsch, Eike Fischer, Sascha De Wall, Timo Schelm, Matthias Arndt, Marc Christopher Wurz

Abstract

As part of the PhoenixD Cluster of Excellence funded by the German Research Foundation at the Leibniz University Hanover, the Institute of Micro Production Technology (IMPT) developed an optical polymer platform for active and passive optical components. At the IMPT injection mold, four-inch diameter wafer-like substrates are fabricated using the laser direct structurable (LDS) high performance thermoplastic materials polyether-ether-ketone (PEEK). The manufactured substrate is structured by mold inlay, which are manufactured in the clean room facilities at the IMPT. The structured substrates are fabricated by lithography and electroplating processes. Cavities down to the sub-micron range can be created. Therefore, passive optical components such as wave-guides or optical gratings will be created on the PEEK substrate. The optical waveguides can be manufactured using PECVD processes, depositing silicon nitride as waveguide-material. Polymer-based wave-guide materials such as poly (methyl methacrylate) (PMMA) can be spin coated into cavities created on the surface of the substrate. In conclusion, the highly performable PEEK-substrate offers a wide range for passive optical components. Concerning active optical components, the laser activatable substrate can provide an electrical infrastructure through laser activating and electro-less deposition technologies for e.g. laser-diodes, photocells or active filters. Additionally, thermal couplings realized by LDS-MID structures can passively manage energy intensive and thermally demanding components such as laser-diodes.

Organisationseinheit(en)

Institut für Mikroproduktionstechnik

Typ

Aufsatz in Konferenzband

Seiten

2191-2196

Anzahl der Seiten

6

Publikationsdatum

2020

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1109/ECTC32862.2020.00341 (Zugang: Geschlossen)