Structuring of laser activated polymers for sensor applications

verfasst von

Sebastian Bengsch, Maximilian Aue, Kevin Cromwell, Marc Christopher Wurz

Abstract

Previous publications have shown that polymer-based materials hold a great potential for the use as substrates for sensors, for example for AMR sensors. Polymers can substitute expensive substrates such as silicon or silicon oxide, and pre-structured substrates can eliminate many necessary cleanroom and micro-technological processes, especially photolithography. Ultimately, process optimization can yield manufacturing processes without expensive procedures (through-silicon vias), guaranteeing a complete abandonment of processes such as photolithography, CMP and the like. At this point, injection molding with laser direct structuring (LDS) polymers offers distinct advantages, such as the electroless and selective deposition of metals through the directly laser-activated polymers, which can be used to implement through-vias. In this context, the LDS-capable polyetheretherketone (PEEK) is employed herein. The thermoplastic polymer has a high glass transition temperature and features chemical resistances to many solvents. As a result, sensors can potentially cover varying areas of application, and it is additionally possible to integrate these components in micro-technological processes. The presented sensor structures were produced by micro-technological processes and contacted using vias realized with the LDS method. As a result, the cost-effective polymer-based module or rather the substrate can be integrated directly into other processes and modules, such as a system on a chip system, without the need for costly process adaptation based on high process variability. To verify this, temperature and magnetic field sensors based on the AMR effect were prepared and evaluated. Accordingly, this article aims to show that wafer-level sensors can be fabricated using a process developed at the Institute of Micro Production Technology (IMPT).

Organisationseinheit(en)

Institut für Mikroproduktionstechnik

Typ

Aufsatz in Konferenzband

Seiten

1883-1888

Anzahl der Seiten

6

Publikationsdatum

05.2019

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1109/ECTC.2019.00290 (Zugang: Geschlossen)