Measurement of the Ultrasound Induced Temperature Change in an Ultrasonic Assisted Silver Sintering Process

verfasst von

Steffen Hadeler, Yangyang Long, Jens Twiefel, Marc Christopher Wurz

Abstract

The process of silver sintering is a key technology in the fabrication of advanced electronic devices. In this study, a multilayer thin film sensor is built and integrated into the joining process of ultrasonic assisted silver sintering to measure the influence of ultrasound on the sintering temperature. The sensor is designed as a resistance thermometer with platinum as the sensing layer. The results show almost a linear relationship between the applied ultrasonic power and the measured temperature increase with a maximum of 4.5 °C at a power level of 7000 mW. In addition, higher normal forces result in greater temperature increase.

Organisationseinheit(en)

Institut für Mikroproduktionstechnik
Industrienahe Sensorik
Institut für Dynamik und Schwingungen

Typ

Aufsatz in Konferenzband

Publikationsdatum

2023

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1109/SENSORS56945.2023.10325249 (Zugang: Geschlossen)