The ultraprecision machining is an integral part of the Institute of Micro Production Technology. The IMPT has many years of experience in the processing of materials with, for example, abrasive cutting and chemical mechanical polishing. The processing of materials takes place here in the mechanical lab and not in the cleanrooms of the IMPT.
The opportunities of a collaboration in research and development or in a small contract are diverse and the following only represent an overview of the possible processes at the IMPT. For your specific needs, please contact Mr. Dipl.-Ing. Manuel Stompe. Of course, you can also get information about the research areas, projects and facilities at the IMPT.
Isolation (by dicing) of brittle materials (ceramic, Si, Poly-Si, glass) up to 2 mm substrate thickness.
Isolation (by dicing) of thin ductile materials (sheet metal, films) up to 0.2 mm substrate thickness.
Isolation (by dicing) of several synthetic materials (PMMA, polycarbonate, PP, POM) up to 3 mm substrate thickness.
Profiling (V or U-profiling) (by dicing) of the materials mentioned above.
Performance measurement and analysis of the abrasive cutting process (dicing) when processing the materials mentioned above.
Plane lapping of various materials (ceramics, Si, Poly-Si, glass, steels)
Plane grinding of brittle materials (ceramics, Si, Poly-Si, glass, CBN-, diamond layers)
Grinding of inclinations in the substrate (ceramics, Si, Poly-Si, glass, steels, several synthetic materials)
Polishing of various substrates (ceramics, Si, Poly-Si, glass, steels, several synthetic materials)
Polishing of thin film technologically-produced layers: galvanic, sputtered, vaporized, CVD, etc.
- Chemical mechanical polishing