At the IMPT, difficult-to-machine materials like silicon (e.g. SiC) or aluminum ceramics (e.g. Al2O3) as well as hard and brittle crystalline silicon can be worked with using cut-off grinding. The axis accuracy of the processing machine is 0.2 µm for the x-axis and 0.1 µm for the y- and z-axes, with repeatability values of 2-3 µm for the x- and y-axes, and 1 µm for the z-axis. With such high precision, structures on substrates/wafers can be produced to be separated (cut-off grinding) or produced in a solid material (profile grinding). The grinding wheels have widths from 25 µm to 500 µm. There is a selection of the most common types of grinding wheels available at the IMPT, such as plastic and metal "hub-less" grinding wheels (75 µm – 500 µm thick) as well as plastic and metal "hub-type" grinding wheels (25 µm – 75 µm).