Logo Leibniz Universität Hannover
Logo: IMPT - Institut für Mikropoduktionstechnik
Logo Leibniz Universität Hannover
Logo: IMPT - Institut für Mikropoduktionstechnik
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Cut-off Grinding

 

 

 

At the IMPT, difficult to machine materials like silicon (e.g. SiC) or aluminum ceramics (e.g. Al2O3) as well as hard and brittle, crystalline silicon can be machined using cut-off grinding. The axis accuracy of the processing machine is 0.2 µm for the x-axis and 0.1 µm for the y and z-axes. The repeatability for the x and y-axes is 2-3 µm and 1 µm for the z-axis. With this high precision, structures on substrates/wafers can be produced separately (cut-off grinding) or in a solid material (profile grinding). The grinding wheels used here have a widths from 25 µm to 500 µm thick. There is a selection of the most common types of grinding wheels available such as plastic and metal, hubless grinding wheels (75 µm – 500 µm thick) as well as plastic and metal, hub-type grinding wheels (25 µm – 75 µm).