At the IMPT, difficult to machine materials like silicon (e.g. SiC) or aluminum ceramics (e.g. Al2O3) as well as hard and brittle, crystalline silicon can be machined using cut-off grinding. The axis accuracy of the processing machine is 0.2 µm for the x-axis and 0.1 µm for the y and z-axes. The repeatability for the x and y-axes is 2-3 µm and 1 µm for the z-axis. With this high precision, structures on substrates/wafers can be produced separately (cut-off grinding) or in a solid material (profile grinding). The grinding wheels used here have a widths from 25 µm to 500 µm thick. There is a selection of the most common types of grinding wheels available such as plastic and metal, hubless grinding wheels (75 µm – 500 µm thick) as well as plastic and metal, hub-type grinding wheels (25 µm – 75 µm).