Logo Leibniz Universität Hannover
Logo: IMPT - Institut für Mikropoduktionstechnik
Logo Leibniz Universität Hannover
Logo: IMPT - Institut für Mikropoduktionstechnik
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Bild zu Anodic Bonder
Anodic Bonder
At the IMPT, it is possible to perform anodic bonding of silicon and borosilicate materials for individual pieces as well as smaller quantities. With a heating furnace, the samples are heated to 400 °C - 500 °C and connected by contacting.

Bild zu Atomic Force Microscope (AFM) - Topometrix TMXC 2000
Atomic Force Microscope (AFM) - Topometrix TMXC 2000
The atomic force microscope (AFM) is a type of scanning probe microscope. A very fine measuring probe (Si tip), locally interactive with the sample surface, scans the surface in a raster process line for line.

Bild zu Confocal Microscope – Keyence VK-9700
Confocal Microscope – Keyence VK-9700
This color 3D laser scanning microscope, Keyence VK-9700, uses the confocal principle to receive data from only one image plane. This will result in images having a large field depth. In addition, an extensive evaluation software is available.

Bild zu Contact Height Sensor - Heidenhain CT60
Contact Height Sensor - Heidenhain CT60
For height measurements of different structures, an incremental height sensor, the CT60 from Heidenhain, is available. With vertical movements of the sensing tip, the distance between a marble tabletop and the surface of the workpiece can be determined very accurately. Different models of several sensing tips are available for the analysis of substrates and samples.

Bild zu Cut-off Machines – Disco DAC551, DAC-2SP
Cut-off Machines – Disco DAC551, DAC-2SP
With cut-off grinding, highly accurate structures made of various materials can be produced using abrasive cutting blades. This method, which belongs to plane and peripheral grinding, allows the separation of wafer chips in industrial applications as well as the production of structures made of primarily hard and brittle materials.

Bild zu Deep Reactive Ion Etch (DRIE) System – Oxford Instruments Plasmalab System 100
Deep Reactive Ion Etch (DRIE) System – Oxford Instruments Plasmalab System 100
With the DRIE process, structures with vertical wall profiles and high aspect ratios can be etched in silicon.

Bild zu Flip-Chip Bonder (Thermocompression and Ultrasound) – Finetech Fineplacer® Lambda
Flip-Chip Bonder (Thermocompression and Ultrasound) – Finetech Fineplacer® Lambda
The flexible bonder, FINEPLACER® Lambda, is in demand for the sub-micrometer range when it comes to high-precision placement, assembly and packaging.

Bild zu Galvanizing Baths
Galvanizing Baths
Using the galvanizing baths at the IMPT, different metals can be precipitated in microlayers. The baths accept wafers with a diameter of four inches.

Bild zu Glass Soldering Oven
Glass Soldering Oven
Glass soldering is based on the melting process of a thin glass layer. The glass layer can be applied to various components through various coating processes and the soldering process itself takes place at 735 °C in an inert athmosphere (usually nitrogen). Depending on the composition and melting point of the glass brazing alloy, other temperature ranges can also be used in the furnace. A maximum temperature of 900 °C can be reached in a short time and the components to be joined can be pre-stressed in a clamping device. At the IMPT, brazing and tempering processes can be carried out with our glass brazing furnace in normal atmosphere or nitrogen. The component size is limited by the furnace chamber to 40 mm x 40 mm x 10 mm.

Bild zu Ion Beam Etching (IBE) – Commonwealth Scientific Corporation
Ion Beam Etching (IBE) – Commonwealth Scientific Corporation
Ion beam etching is used for the removal and structuring of thin layers, and technically a dry etching method. The material removal is purely physical because of the impact of high-energy particles with the material surface. At the IMPT, an ion beam system from Commonwealth Scientific Corporation is used.

Bild zu Laminator – Bungard RLM 419p
Laminator – Bungard RLM 419p
At the IMPT, a dry film laminator with infrared scanning, RLM 419p, from the company Bungard Electronics is available for the lamination of wafers with photo laminates, special laminates for solder resist masks, and other films.

Bild zu Lapping and Nano Grinding Machines – P. Wolters 3R40
Lapping and Nano Grinding Machines – P. Wolters 3R40
For the surface treatment of smaller substrates down to 4 inches in diameter, four lapping machines (P. Wolters 3R40) are available at the IMPT. The machines accept discs with a maximum diameter of 400 mm (16 inches).

Bild zu Laser Doppler Vibrometer (LDV) – Polytec OFV-552
Laser Doppler Vibrometer (LDV) – Polytec OFV-552
With the laser Doppler vibrometer (LDV) from Polytec, the smallest vibrations even in the nanometer range can be measured. The LDV can represent these vibrations in time and frequency domains. Furthermore, it is possible to perform a surface scan with raster scanning and analyze the motion of surfaces. This is also a stroboscope head available by which a vibration measurement in the plane can be performed.

Bild zu Light Microscope / Magnifiers
Light Microscope / Magnifiers
At the IMPT, different light microscopes and magnifiers are available for optical monitoring and measuring of components.

Bild zu Magneto-Optical Microscope – evicomagnetics Kerr Microscope with Matesy Faraday effect magnetic sensor
Magneto-Optical Microscope – evicomagnetics Kerr Microscope with Matesy Faraday effect magnetic sensor
The Kerr effect can be applied to any metallic or otherwise light-absorbing magnetic material with a sufficiently smooth surface to observe magnetic domains on the surface of the material. The microscope can generate an AC magnetic field to observe domain formation. If the surface conditions is not met, it is alternatively possible to use the Faraday effect to detect static magnetic domains of the material.

Bild zu Mask Aligner - SÜSS MicroTec MA/BA6
Mask Aligner - SÜSS MicroTec MA/BA6
The mask aligner, MA-6, from Karl SÜSS, represents the standard photolithography system at the Institute of Micro Production Technology. Substrates from 4” to 6” can be exposed with wavelengths of 405 nm and 365 nm. With the MA-6, structures up to 10 µm edge length can be exposed.

Bild zu Nanoindenter – Hysitron TI 900 Triboindenter ®
Nanoindenter – Hysitron TI 900 Triboindenter ®
With nanoindentation, mechanical properties of surfaces with a depth of up to 1 µm can be determined. A defined force is applied with a diamond tip (Berkovich tip), and from the residual indent, the E-modulus and strength of the material can be determined.

Bild zu Non-contact Height Sensor – Keyence LK-H052
Non-contact Height Sensor – Keyence LK-H052
The digital height sensor from Keyence allows a non-contact measurement of height as well as the recording of a height profile. The height sensor is coupled with an evaluation computer that you can use with a software program to quickly find the height and profile of the sample.

Bild zu Plasma System – PVA TePla PS 4008 Asyntis / OEM
Plasma System – PVA TePla PS 4008 Asyntis / OEM
A plasma system 4008 from PVA TePla AG is available at the IMPT. Radicals are generated in a plasma, which are conducted to the process chamber and remove organic layers or impurities from the substrates by a chemical reaction without mechanically damaging or changing the surfaces. To remove the unneeded components on the substrate, both the gas flow and the composition of the process gas for plasma formation, as well as the generator power and the substrate temperature can be individually adjusted.

Bild zu Plasma-Enhanced Chemical Vapor Deposition (PECVD) – Oxford Instruments Plasmalab 80plus
Plasma-Enhanced Chemical Vapor Deposition (PECVD) – Oxford Instruments Plasmalab 80plus
PECVD—plasma-enhanced chemical vapor deposition is a process in which a thermally and electrically excited ionization of gases or gas mixtures in a chemical reaction deposits a thin, solid, and, in the case of insulating materials, usually glass-like phase on a substrate.

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