Miniaturized 3D Glass Package for High-Efficiency and High-Power Density 48V DC-DC Converters
Abstract
A 3D glass packaging solution has been developed as a power brick module for high-efficiency, high-power density 48 V DC-DC converters, which are essential for applications such as data centers, telecommunications, and autonomous driving. As compute power demands increase, transitioning from 12 V to 48 V architectures significantly reduces power distribution losses. By leveraging 3D heterogeneous integration, the presented design features vertical stacking of passive and active components, including an isolated supply, a digital signal isolator and a GaN half-bridge, within a modular power brick. The top placement allows for various cooling options for the thermal management, as the half-bridge is designed for high currents up to 35 A. The package employs three precisely structured glass substrates, utilizing selective laser-induced etching and laser ablation to form complex glass geometries and conductive paths. The electrical functionality of the circuit is validated in an 48 V application with an isolated ground. With the 3D integration in a glass-based package, a footprint reduction of 56% compared to a traditional planar PCB implementation is achieved. These advancements underscore the potential of glass substrates for enhancing power density and facilitating the integration of glass packages in future 48 V applications.
Details
- Organisationseinheit(en)
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Institut für Mikroproduktionstechnik
Institut für Mikroelektronische Systeme
Fachgebiet Mixed-Signal-Schaltungen
Laboratorium für Nano- und Quantenengineering
- Typ
- Aufsatz in Konferenzband
- Publikationsdatum
- 08.04.2025
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Energieanlagenbau und Kraftwerkstechnik, Elektrotechnik und Elektronik, Elektronische, optische und magnetische Materialien
- Elektronische Version(en)
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https://doi.org/10.1109/IWIPP61784.2025.10971568 (Zugang:
Geschlossen
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