ResearchPublications
Investigations on the Influence of the Substrate’s Thickness on the Cut Quality During Dicing of thin Silicon Wafers

Investigations on the Influence of the Substrate’s Thickness on the Cut Quality During Dicing of thin Silicon Wafers

Categories Konferenz (reviewed)
Year 2005
Authors H.H. Gatzen, G. Günzel
Published In Proc. euspen 5th Int. Conf. and 7th Ann. Gen. Meet. 2005, Montpellier, France, Vol. 2, pp. 589-590