ResearchPublications
Eutectic bonding of integrated circuits onto polycarbonate and poly(methyl methacrylate) by means of indium-tin and indium-bismuth

Eutectic bonding of integrated circuits onto polycarbonate and poly(methyl methacrylate) by means of indium-tin and indium-bismuth

Categories Zeitschriften/Aufsätze (reviewed)
Year 2015
Authors Meriem Akin, Sonda Moakhar Ep Bouguecha, Juergen Becker, Lutz Rissing
Published In IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI 10.1109/TCPMT.2015.2420531