ResearchPublications
Hybrid packaging of circuits and devices onto flexible screen printed electrical interconnects

Hybrid packaging of circuits and devices onto flexible screen printed electrical interconnects

Categories Konferenz (reviewed)
Year 2015
Authors Meriem Akin, Joe Corea, Simon Scott, Ana Claudia Arias, Marc Wurz, Lutz Rissing
Published In SMTA Pan Pacific Microelectronics Symposium, Kauai, HI, USA
DOI 10.13140/RG.2.1.2064.9763/1