ResearchPublications
Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives

Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives

Categories Zeitschriften/Aufsätze (reviewed)
Year 2015
Authors T. Geipel, L. C. Rendler, M. Stompe, U.h Eitner, L. Rissing
Published In Energy Procedia, Volume 77, August 2015, Pages 346-355, ISSN 1876-6102
DOI 10.1016/j.egypro.2015.07.049