ResearchPublications
Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process

Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process

Categories Konferenz (reviewed)
Year 2017
Authors Long Y, Dencker F, Isaak A, Li C, Schneider F, Hermsdor J, Wurz MC, Twiefel J, Wallaschek J
Published In IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, p. 203-206
Description