ResearchPublications
Visualization of Oxide Removal during Ultrasonic Wire Bonding Process

Visualization of Oxide Removal during Ultrasonic Wire Bonding Process

Categories Konferenz (reviewed)
Year 2018
Authors Long Y, Dencker F, Isaak A, Schneider F, Hermsdor J, Wurz MC, Twiefel J
Published In IEEE Electronics Packaging Technology Conference (EPTC), Singapore, p. 1-4