ResearchPublications
Electroplating through Fluidic Channels as Production Technology for 3D Interconnect Devices and Sensing Structures

Electroplating through Fluidic Channels as Production Technology for 3D Interconnect Devices and Sensing Structures

Categories Konferenz
Year 2016
Authors Rechel M, Bengsch S, Wurz MC
Published In ECS Transactions. 2016 volume 75, issue 7, 25-32
DOI 10.1149/07507.0025ecst
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