ResearchPublications
Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

Categories Konferenz (reviewed)
Year 2017
Authors Long Y, Dencker F, Schneider F, Emde B, Li C, Hermsdorf J, Wurz MC, Twiefel J
Published In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
ISBN 978-150904368-2
DOI 10.1109/EPTC.2016.7861512