ResearchPublications
Atom Chip technology for use under UHV conditions

Atom Chip technology for use under UHV conditions

Categories Konferenz
Year 2019
Authors Kassner A, Rechel M, Heine H, Herr W, Christ M, Krutzik M, Rasel EM, Wurz MC
Published In Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, Barcelona, Spain, 2019, pp. 69-75
ISBN 978-3-8007-4919-5
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