Research
Current Projects

Current Research Projects at the Institute of Micro Production Technology

  • InnoVaQ
    The development of quantum sensors suitable for everyday use requires a high degree of miniaturization and integration of the vacuum system. In the InnoVaQ (Innovative Vacuum Technology for Quantum Sensors) research project, technologies are being developed that together allow a highly compact ultra-high vacuum setup to be realized for a strontium atom-based quantum sensor. In the long term, the increasing miniaturization in the field of quantum sensor technology not only leads to a reduction in the size of the housing, but also necessitates a vacuum periphery of the corresponding size. Thus, a miniaturized pumping technique is needed to develop compact and transportable quantum sensing technology. In this context, the IMPT is developing a combined device in cooperation with LPKF®, which is similar to an ion getter pump in terms of its functional principle. The core component is a magnet-free field emitter which does not influence the measurements of the quantum system. Two approaches are being pursued for the technical implementation of the emitter, firstly a silicon-based approach (IMPT) and secondly a glass-based approach manufactured using LIDE technology (LPKF®). The pumping technology to be realized by IMPT is based on micro-engineered field emitters in the form of tips fabricated by a cut-off grinding process. This technology has been patented by Leibniz Universität Hannover and enables the production of highly integrable emitter tips that act as electron sources for ionization in miniaturized ion getter pumps. Importantly, in the developed vacuum system, the pressure in the ultra-high vacuum (UVH) region is 10-8 to 10-11 mbar. To reach this pressure, a combination of backing pumps and high vacuum pumps is needed, since single-stage pumping from atmospheric pressure to UHV is not possible. After reaching the target pressure, the miniaturized vacuum pump developed in this project should be able to maintain and measure the pressure.
    Year: 2022
    Funding: Bundesministerium für Bildung und Forschung
    Duration: 01.01.2022-31.12.2024
  • SFB 1368 C03 – Investigation of tribological systems for tool coatings in an inert atmosphere
    In the Collaborative Research Center 1368 "Oxygen-free production", processes and mechanisms in manufacturing technology processes are investigated that are carried out in an oxygen-free atmosphere. In subproject C03, the IMPT is investigating the influence of the atmosphere on tribological systems for the subsequent development of tool coatings in an inert atmosphere. Important aspects include the identification and quantification of fundamental relationships of wear processes in silane-doped atmospheres, diffusion and adhesion effects and the investigation of possible novel alloy formations at the interfaces.
    Year: 2020
    Funding: DFG
    Duration: 2020 - 2023
    © IMPT
  • AiF
    The component quality of deep-drawn parts is subject to certain process fluctuations in series production due to constantly changing input variables. In this context, comprehensive process monitoring could ensure consistent drawn part quality and reduce the number of rejects. Within the scope of the project, the material flow of the deep-drawing sheet is to be recorded and evaluated with the aid of a sensor unit specially developed for this purpose at the IMPT. The project includes, among other things, the simulative design and thin-film production of an inductive sensor as well as the construction of a control loop in an industrial environment.
    Year: 2019
    Funding: Forschungsvereinigung für Stahlanwendungen (FOSTA)
    Duration: 2019 - 2021
  • HARD - Hannover Alliance for Research on Diamond
    The IMPT, in collaboration with Prof. Dr. Uwe Morgner (Institute of Quantum Optics, IQO), Prof. Dr. Michael Kues (Institute of Photonics, IOP), Prof. Dr.-Ing. Marc Wurz (DLR Institute of Quantum Technology, University of Ulm), the Institute of Solid State Physics at the PTB Braunschweig and the AG Paasche (VIANNA, Medical School Hanover), has obtained a grant of 2.6 million euros for the expansion of regional infrastructure for research on the material diamond. In the infrastructure project "Hannover Alliance of Research on Diamond (HARD)", equipment for the production, structuring, and integration of diamond coatings will be procured and put into operation. With these measures, which are financed by the European Regional Development Fund (ERDF) within the REACT-EU initiative, the infrastructure for diamond research will be significantly expanded. Future research topics in the fields of production technology, optics, quantum optics and gravitational physics, as well as biomedical technology will be supported.
    Led by: Prof. Dr. Uwe Morgner
    Year: 2022
    Funding: REACT-EU EFRE
    Duration: 01.01.2022 - 31.03.2023
  • MicroMill
    Micro-milling is increasingly finding applications due to advancing developments in micro-tool manufacturing. Structuring a workpiece with geometries on a micrometer scale is possible thanks to tools with ever smaller diameters. However, these are costly to manufacture. Each milling tool must be made from solid material and undergo time-intensive grinding. This is then reflected in the price of the tools. The micro milling tools to be produced in this project are to be manufactured from silicon carbide in a batch production process, so that several hundred milling heads can be produced per time. A dry etching process will be used to pattern the milling heads, and its process parameters must be evaluated for the most anisotropic etching possible at high etch rates. Since the milling tool is produced in two parts and consists of a milling head and tool shank, an ideal joining method is sought with which both parts can be reliably joined. For this purpose, different adhesives and chemical as well as mechanical surface treatments are tested on the surfaces to be joined. The resulting adhesive strength of the two tool parts will be investigated. Furthermore, a very precise assembly technique must be developed so that the milling head can be centered on the tool shank. Otherwise, among other things, inaccuracies in the shape of the workpieces may occur. The manufacturing process will then be industrialized with the project partner Reißfelder Profilschleifen GmbH and the application limits of the milling tools will be tested on various materials with industrial benefits, such as copper or steel. The end result should be small micro milling tools made of silicon carbide, which can be used for machining in various areas, such as medical technology, and can be produced on an industrial scale.
    Year: 2021
    Funding: Förderprogramm ZIM (Zentrales Innovationsprogramm Mittelstand) des Bundesministeriums für Wirtschaft und Energie (BMWi)
    Duration: 2021-2023
  • ISiG – Integrated Sensors for intelligent Large-Diameter Bearings
    In the context of digitization, the acquisition of measurement data plays a central role in the use of large components. For rolling bearings, the application of conventional sensors is hardly possible in situ due to the dimensions, so that the "ISiG" project addresses the use of various customized thin-film sensors. They will be produced directly on the machine element through coating processes that produces integrated, component inherent sensors on the measurement object. In cooperation with the Institute of Machine Design and Tribology (IMKT), the first step is to simulate the mechanical loads that occur and to derive the design of the sensor nodes. The high surface pressure, slipping and wear place the highest requirements on the sensor technology, which is why the development of redundant sensor systems by means of intelligent sensor data fusion represents a primary goal.
    Year: 2021
    Funding: DFG
    Duration: 2021-2024
  • ENDEMAR (Energy Saving by Use of Multiple Autarkic Control Sensor Systems)
    Intelligent Energy Flow – Reduction of Energy Consumption through Maintenance Free Sensors in Buildings and Accommodations The project is funded by the German Federal Ministry for Economic Affairs and Energy. The aim is to intelligently control and reduce the energy consumption within factory buildings and warehouses. The function will be demonstrated with LED light sources, but remains open for other energy users such as air-conditioning systems or heatings. The control is based on intelligent, maintenance free autarkic sensors with passive and active control functions and ultra-low energy consumption. Within the project three industrial companies and three research facilities are collaborating. The IMPT is supporting by developing a suitable energy-optimized energy-harvester for powering of autarkic, maintenance free control panels.
    Year: 2021
    Funding: German Federal Ministry for Economic Affairs and Energy
    Duration: 2021-2024
  • QGyro+
    The QGyro+ research project aims to develop and test high-precision quantum inertial sensors to support conventional inertial navigation sensors, which can be used for autonomous navigation. The central goal of the project is to develop a six-axis quantum inertial navigation sensor. This device will be used to test drift-free and highly accurate quantum inertial sensors for the first time for use in autonomous navigation, opening the way to new fields of application. This sensor is to be built and used as a compact experimental platform in the course of the project (QINS experimental platform).
    Year: 2021
    Duration: 2021-2025
  • Magnetic Measurement Advances (MagMA)
    In the research project Magnetic Measurement Advances (MagMA), the IMPT is developing possible measurement methods and equipment for its industrial partner GlobalFoundries to determine the quality and properties of deposited magnetic layers without the wafers having to leave the production line. Due to the limitations of established measurement methods, the examination of the layers is necessarily performed on separated pieces of the wafer. However, this means that further processing of the wafer is no longer possible, since it can only be processed as a whole. This not only causes considerable additional costs in the development of new layer stacks, but also in the quality assurance of existing systems and processes.
    Led by: Eike Fischer
    Year: 2021
    Funding: GlobalFoundries
    Duration: 2021 - 2022
  • Quantum Valley Lower Saxony
    The overall goal of the QVLS is to build a 50 qubit quantum computer. The IMPT is part of this excellent research network with access to unique infrastructure of the whole consortium. The team has excellent national and international networks and participates (besides QVLS-Q1) in important collaborations, including the Cluster of Excellence "QuantumFrontiers". The IMPT is part of several teams. In QVLS T2.4, building on our expertise in atom chip fabrication, we are addressing the design and construction of an atom chip with the possibility of depositing a glass package on the surface of the atom chip and encapsulating it. In this course, we are evaluating joining techniques with respect to hermeticity. Furthermore, in a novel implementation of these atom chips with a grating-based magneto-optical trap, we aim to integrate an optical grating into the atom chip surface. In QVLS T3.1, we are developing processes and methods to connect an ion trap chip together with the associated quantum control components (CMOS electronic chip, active photonic chip, passive optical interposer). This includes all connections to the outside world (cables, fibers). This ion trap packaging solution will be based on 3D hybrid integration techniques to enable stacking and bonding of dies from ceramic, glass and silicon substrates at wafer level. In QVLS T3.3, as part of the miniaturization of the vacuum system and the peripherals necessary for the operation of the quantum sensor, we are addressing the evaluation of joining glass to titanium and joining components under UHV conditions (themo-compressive and anodic). Furthermore, we are involved in the development of a pumping technique, which will initially be based on non-evaporable getter materials (NEG). Furthermore, we are developing and characterizing a platform for chip-based atomic sources for use in quantum sensors.
    Year: 2021
    Funding: VolkswagenStiftung & Niedersächsisches Ministerium für Wissenschaft und Kultur
    Duration: 2021 - 2025
  • Force-sensitive guidance systems based on direct-deposited component-specific sensor technologies
    In the machine tools of modern production technology, forces represent an important source of information for process controlling and condition monitoring. Measuring of the occurring process forces allows the detection of tool breakages and process errors. Additionally, the tool displacement and the tool wear can be estimated. With the example of a portal milling machine, new types of direct-deposited strain gauges are used in this project due to the high demands on the necessary sensors. They are produced directly on the guide carriages, which are used to move the milling head in all three spatial directions on linear profile rails. The result are particularly thin and sensitive sensors that can record the forces and torques with high precision. Methods for simulating the optimum sensor positions and sensor data fusion exploit the full potential of the technology.
    Year: 2021
    Funding: DFG
    Duration: 2021 - 2024
    © Bosch-Rexroth
  • Gallium Nitride for Advanced Power (GaN4AP)
    The GaN for Advanced Power (GaN4AP) project is an international collaborative project funded by the EU's ECSEL initiative. Worldwide, the number of hybrid and electric cars is growing steadily. This is accompanied by a greater need for high-performance electronics in charging technology. In order to meet the increasing demand, high power transformers based on Galium Nitride will be realized in this project with partners from Italy, Czech Republic, France and Germany. IMPT is participating in the project by manufacturing transformers and inductors in planar technology on Printed Circuit Boards (PCBs) and Molded Interconnect Devices (MID). These are essential for driving and filtering the electrical signal. The planar structure meets the demands for miniaturization of electrical systems and simultaneous increase in performance.
    Year: 2021
    Funding: ECSEL (EU)
    Duration: 2021 - 2024
  • Ultrasonic silver sintering
    Today's demands on power electronics have risen significantly, especially due to e-mobility, making the connection properties of proven methods such as soldering or adhesive bonding no longer adequate for future requirements. Silver compound sintering is gaining in importance due to its superior electrical and thermal properties. However, the long process times and high temperatures and pressures prevent the extensive use of this joining method. This is where the DFG-funded project sets in and researches the optimisation of these process parameters by using ultrasound. With the help of suitable alloy partners, low-melting sintering pastes are also being produced, with which the process of Ultrasonic Transient Liquid Phase Sintering (ULTPS) will be established.
    Year: 2021
    Funding: DFG
    Duration: 2021 - 2023
  • Batch manufactured flexible micro-grinding tools for finishing metallic surfaces
    Grinding tools manufactured by thin-film technology show great potential for the production of high surface finishes and for the manufacture of microstructures. The aim of this project is to investigate and model the relationships between the manufacturing process and the application behavior of the novel, compliant micro-grinding tools. In this context, the technological and economic potential of the lithographically produced tools is also to be identified, especially with regard to batch production. In order to ensure workpiece machining and to demonstrate the tool potential, basic tools with defined parameters will be manufactured according to the requirement profiles of ultra-precision and micro-machining. The characterization of the application behavior of the micro-grinding tools represents a further objective of this project. The main focus is on analyzing the relationships between the abrasive and support layers as well as the application behavior and the manufacturing result. Based on the results of the investigation, an empirical wear model will be developed. Furthermore, the project aims at the development of an electrochemical cell for the oxidation of copper surfaces. This process is intended to control the mechanical properties of the surface in a targeted manner in order to counteract the ductile behavior of the copper during ultraprecision machining and micromachining. This can enable better structuring and higher surface finishes. The cell will also be integrated into a 5-axis CNC milling machine to seamlessly integrate the electrochemical machining of the workpiece into metal-cutting process flows. The oxide behavior of the copper workpieces will also be modeled based on the results. Furthermore, a validation of the models and the tool production will be carried out during the project. Adapted workpieces will then be manufactured and tested on the basis of defined application scenarios.
    Year: 2019
    Funding: Deutsche Forschungsgemeinschaft (DFG)
    Duration: 2019 - 2022
  • WInSiC4AP
    The project “Wide Band Gap Innovative SiC for Advanced Power” (WInSiC4AP) is an international collaborative project funded by the EU ECSEL initiative. More than 20 partners from France, Italy and Germany are jointly developing semiconductor elements and circuits based on silicon carbide (SiC). This semiconductor material is known for its large band gap, which allows transistors to operate at higher voltages and frequencies and also has better efficiency compared to silicon or germanium. Based on such transistors, high-voltage converters for e.g. electromobility, are jointly developed and tested. As a partner in this project, the IMPT is conducting research together with Würth Elektronik on integrated transformers that are integrated within the printed circuit board. These components therefore save space, which then can be used for other electronic components and also allow a height reduction. Conventional inductors and, above all, transformers are often decisive in terms of the space required on a circuit board due to their classic production with wound copper wire. The developed transformers are supposed to be used in gate driver circuits of SiC MOSFETs.
    Year: 2017
    Funding: ECSEL (EU)
    Duration: 2017 - 2021
  • SFB 653 T14 - Development and manufacturing of direct-deposited sensors on bottom hole assemblies
    Within the Collaborative Research Center 653 "Intelligent Components in the Life Cycle" this transfer project has been developed in cooperation with an industrial partner. The aim of the project is the thin-film production of sensitive strain gauges that can detect the mechanical stresses of drilling bottom hole assemblies and withstand the harsh conditions underground. A novel, patent-pending coating system is used for this purpose, which allows sensors to be deposited directly onto component surfaces of any size. In addition to the development of temperature-compensated strain gages, the project also addresses the aspect of deposition on curved surfaces.
    Year: 2018
    Funding: DFG
    Duration: 2018 - 2021
  • PhoenixD
    The Cluster of Excellence PhoenixD deals with the topic of realising optical precision devices quickly and cost-effectively using additive manufacturing. This vision unites researchers from the faculties of mechanical engineering, physics, electrical engineering, computer science and chemistry at Leibniz Universität Hannover and TU-Braunschweig. The researchers are working together on the simulation, production and application of optical systems. The systems currently based on glass are complex, usually manufactured by hand and sometimes require large installation spaces. The cooperation of the different departments is now to develop a digital manufacturing system with which individualised optical products can be realised.
    Year: 2019
    Funding: DFG
    Duration: 2019 - 2025
  • Quantum Frontiers
    The Cluster of Excellence QuantumFrontiers combines the research strengths of Leibniz Universität Hannover, TU Braunschweig and the Physikalisch-Technische Bundesanstalt in Braunschweig with the aim of developing new measurement concepts and sensor topologies based on photonic systems, dedicated semiconductor systems, nanostructures, quantum-manipulated atomic and molecular ensembles, and even macroscopic objects. The IMPT focuses mainly on atomic interferometry and is involved with two research groups.
    Year: 2019
    Funding: DFG
    Duration: 2019 - 2025
  • QCHIP
    The Institute of Microproduction Technology (IMPT) develops so-called atom chips as components of magneto-optical traps for compact matter wave interferometers. In combination with sophisticated laser cooling, these atom chips generate magnetic field configurations to trap and cool atoms by exploiting the Zeeman effect. This represents the first step in creating a bose-einstein condensate that serves as a test mass for interferometry. In order to use such high-precision matter-wave interferometers in the field or on board satellites, miniaturization will be pursued. The number of lasers and electronics required for cooling can be reduced by patterning the surfaces of atomic chips with optical gratings. By cleverly exploiting diffraction effects, operation can thus be achieved with just one laser.
    Year: 2019
    Funding: BMWi
    Duration: 2019 - 2022
  • KACTUS II
    Within the first joint project KACTUS, a new generation of atom chips could be developed at IMPT in collaboration with the Institute of Quantum Optics (IQ) and the Humboldt University Berlin (HUB), which are characterized by more suitable materials and better joining processes, so that this new atom chip generation is characterized by faster switching behavior and better vacuum properties. Based on this novel platform, further functions are to be added to the atom chips within the framework of KACTUS II, which, in addition to further miniaturization, will also result in a drastic reduction in the complexity of the overall structure. Here, the focus is on the investigation of new chip materials, the introduction of several current-carrying layers per chip and the improvement of the optical quality of the mirror layer for interferometric applications.
    Year: 2019
    Funding: BMWK
    Duration: 2019 - 2022
  • Fundamental investigation of the mechanisms of ultrasonic wedge-wedge bonding using varying topographies
    Ultrasonic wire bonding has been used in microelectronics for more than half a century. However, the underlying mechanisms are not fully understood, which prevents further improvement of this technique. This project’s aim is to find unknown mechanisms and investigate their influence on the bonding process.
    Year: 2017
    Funding: Deutsche Forschungsgemeinschaft (DFG)
    Duration: 2017 - 2019